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A method for manufacturing a chip electrode of a negative temperature coefficient thermistor

A thermistor chip and negative temperature coefficient technology, which is applied in the direction of resistors with negative temperature coefficient, resistance terminals/electrodes, etc., can solve the problem that the functional thickness of the silver layer cannot meet the requirements, the structure of the silver layer is not uniform enough, and the fine-grained silver powder Problems such as reunion, to achieve the effect of improving the pass rate of 1% resistance accuracy, suppressing the tendency of easy reunion, and uniform silver layer structure

Active Publication Date: 2017-05-03
GUANGZHOU MAGNET ELECTRICITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in this patent, AgO is completely used to replace silver powder, resulting in a decrease in the actual silver content in the paste, and the functional thickness of the silver layer cannot meet the requirements
[0009] The structure of the silver layer is not uniform enough
Especially for the silver paste made by the matching method of thickness, the fine particle silver powder agglomeration phenomenon is serious, which affects the performance

Method used

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  • A method for manufacturing a chip electrode of a negative temperature coefficient thermistor
  • A method for manufacturing a chip electrode of a negative temperature coefficient thermistor
  • A method for manufacturing a chip electrode of a negative temperature coefficient thermistor

Examples

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Effect test

Embodiment 1

[0049] MnNiFeAlO 4 The steps of making the electrode of the negative temperature coefficient thermistor chip are as follows:

[0050] Put the prepared copper paste on a 250 mesh screen, and use a scraper to screen print MnNiFeAlO 4 The upper and lower sides of the ceramic substrate are baked at 150°C for 10 minutes, then placed in a vacuum furnace, and the vacuum degree is 2×10 -4 mmHg; then pass in 0.05L / min of oxygen, heat up to 610°C at a temperature rise rate of 5°C / min and keep it for 12 minutes, and then cool down to room temperature at a temperature drop rate of 5°C / min. A thermistor with an intermediate layer of copper electrodes was obtained (the thickness of the copper layer was 2.5µ).

[0051] Put the above thermistor with copper electrode middle layer on a 250 mesh screen with a squeegee to print a layer of silver paste on the top and bottom. After baking at 150°C for 10 minutes, place it in a vacuum furnace. ×10 -4 mmHg, then pass in 0.05L / min of oxygen, heat up to 720...

Embodiment 2

[0061] MnNiFeAlO 4 The steps of making the electrode of the negative temperature coefficient thermistor chip are as follows:

[0062] Put the prepared copper paste on a 250 mesh screen, and use a scraper to screen print MnNiFeAlO 4 The upper and lower sides of the ceramic substrate are baked at 150°C for 10 minutes, then placed in a vacuum furnace, and the vacuum degree is 2×10 -4 mmHg, then pass in 0.05L / min oxygen, heat up to 620°C at a temperature rise rate of 5°C / min and keep it for 12 minutes, and then cool down to room temperature at a temperature drop rate of 5°C / min. A thermistor with an intermediate layer of copper electrodes is obtained (the thickness of the copper layer is 2.63µ).

[0063] Put the above thermistor with copper electrode middle layer on a 250 mesh screen with a squeegee to print a layer of silver paste on the top and bottom. After baking at 150°C for 10 minutes, place it in a vacuum furnace. ×10 -4 mmHg, then pass in 0.05L / min oxygen, heat up to 710°C at a...

Embodiment 3

[0073] MnNiFeAlO 4 The steps of making the electrode of the negative temperature coefficient thermistor chip are as follows:

[0074] Put the prepared copper paste on a 250 mesh screen, and use a scraper to screen print MnNiFeAlO 4 The upper and lower sides of the ceramic substrate are baked at 150°C for 10 minutes, then placed in a vacuum furnace, and the vacuum degree is 2×10 -4 mmHg, then pass in 0.05L / min of oxygen, heat up to 630°C at a temperature rise rate of 5°C / min and keep it for 12 minutes, and then cool down to room temperature at a temperature drop rate of 5°C / min to obtain a heat with a copper electrode intermediate layer Sensitive resistance (copper layer thickness is 2.65µ).

[0075] Put the above thermistor with copper electrode middle layer on a 250 mesh screen with a squeegee to print a layer of silver paste on the top and bottom. After baking at 150°C for 10 minutes, place it in a vacuum furnace. ×10 -4 mmHg, then pass in 0.05L / min oxygen, heat up to 740°C at a ...

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Abstract

The invention discloses a manufacturing method of a negative-temperature-coefficient thermistor chip electrode. The method comprises the following steps: (1) washing and cleaning a NTC thermistor ceramic substrate in an organic solvent, coating the NTC thermistor ceramic substrate by a layer of copper paste, drying the NTC thermistor ceramic substrate, sintering the NTC thermistor ceramic substrate in a weak oxidation atmosphere, and preparing a copper electrode intermediate layer on the NTC thermistor ceramic substrate; and (2) coating the copper electrode intermediate layer by a layer of silver paste, drying the copper electrode intermediate layer with the silver paste, sintering the copper electrode intermediate layer with the silver paste in a weak oxidation atmosphere to prepare a layer of silver electrode on the copper electrode intermediate layer. According to the method, the copper electrode intermediate layer and the silver electrode layer are obtained, so that the resistance precision qualification rate of the product can be increased by 1 percent.

Description

Technical field [0001] The invention provides a method for manufacturing a negative temperature coefficient thermistor chip electrode. Background technique [0002] Negative temperature coefficient (NTC) thermistor is an electronic ceramic material whose resistance decreases with increasing temperature, and is widely used in temperature sensors to measure temperature. Usually the electrode layer of the NTC thermistor chip is a single silver electrode structure, which is obtained by screen printing with silver paste and then sintering. The requirements for the electrode layer are: the silver electrode layer and the ceramic substrate have good bonding strength, the silver layer has a uniform structure, and the silver firing temperature is as low as possible to reduce the impact of high temperature on the brittleness and flatness of the substrate. As the performance requirements for NTC thermistors increase, the electrode layer is naturally required to have better performance to ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C1/14
Inventor 谭育新谭小桩许贝陈军
Owner GUANGZHOU MAGNET ELECTRICITY
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