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2results about How to "Avoid hard clumping" patented technology

A high specific surface area mesoporous tin oxide powder and its preparation method

PendingCN122276817Aavoid coarseningavoid abnormal growthElectrical batteryKetone
This invention discloses a high specific surface area mesoporous tin oxide powder and its preparation method. The method includes: dissolving a tin source in a mixed solvent of alcohol and deionized water, adding a ketone complexing agent and a nonionic dispersant, and stirring to form a tin-based complex precursor solution; then transferring the solution to a hydrothermal reactor for hydrothermal aging treatment, causing the precursor solution to hydrolyze and condense, forming gel particles in situ; after solid-liquid separation, washing with alternating anhydrous ethanol and dilute ammonia water, and drying to obtain the precursor powder; finally, performing staged heating calcination under an air-nitrogen mixed atmosphere, first removing organic components at low temperature, and then completing the crystal phase transformation at high temperature to obtain rutile phase SnO2 powder. The powder has an average particle size of 8–15 nm and a specific surface area of ​​85–110 m² / g. 2 The powder has a pergola size of 3–6 nm and good dispersibility. This invention effectively suppresses grain agglomeration through complexation regulation, hydrothermal-sol-gel coupling, and gradient atmosphere calcination. The prepared powder is suitable for applications such as gas sensors, lithium-ion battery anodes, or transparent conductive films.
Owner:LUOYANG JINGLIAN OPTOELECTRONIC MATERIALS CO LTD

A method for preparing a black alumina substrate

ActiveCN121651888BHigh thermal conductivity and lowReduced insulation performanceCleaning processes and apparatusSlurryUltimate tensile strength
This invention relates to the field of electronic ceramic substrates and provides a method for preparing a black alumina substrate, which solves the defects of existing black alumina substrates, such as low thermal conductivity and low mechanical strength, due to defects in the preparation process. The preparation steps include: (1) preparing raw materials; (2) preparing slurry; (3) casting; (4) debinding; (5) sintering; (6) annealing; and (7) surface treatment.
Owner:FUJIAN HUAQING ELECTRONICS MATERIAL TECH