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Water-oxygen blocking film and packaging technology for flexible film electronic device

A technology for water-oxygen barrier films and electronic devices, which is applied in electric solid devices, electrical components, semiconductor devices, etc., can solve problems such as continuous growth of defects, and achieve the effect of thin thickness and good water sample barrier performance.

Active Publication Date: 2015-02-18
GUANG ZHOU NEW VISION OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, similar to the above-mentioned literature problems, the same material structure has very little difference, and it is still easy to cause the continuous growth of defects.

Method used

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  • Water-oxygen blocking film and packaging technology for flexible film electronic device
  • Water-oxygen blocking film and packaging technology for flexible film electronic device
  • Water-oxygen blocking film and packaging technology for flexible film electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A water-oxygen barrier film for flexible thin-film electronic devices, such as figure 1 As shown, the composite film is composed of multiple layers of barrier layers for blocking water and oxygen molecules and multiple layers of absorbing layers for decoupling and absorbing water and oxygen molecules. Both the barrier layer and the absorbing layer are inorganic films, and the composite film It is a pure inorganic composite film. The overall thickness of the composite film is not greater than 1 micron, at 30 o C. Under the condition of 100% relative humidity, it should not be higher than 6.52×10 -4 g / m 2 / day water vapor transmission rate.

[0036] The composite film includes the bottom layer in contact with the device, the top layer in contact with the atmosphere, and an intermediate layer arranged between the bottom layer and the top layer. Both the bottom layer and the top layer are barrier layers, and any adjacent two layers constituting the composite film The l...

Embodiment 2

[0048] A packaging method for flexible thin-film electronic devices, using the water-oxygen barrier film of Example 1 as the packaging layer, the packaged product has good water-oxygen barrier performance, and can achieve good water-oxygen barrier properties under a thinner structure. isolation performance.

Embodiment 3

[0050] The water and oxygen barrier films of three kinds of flexible thin film electronic devices were prepared for performance comparison, and the structures were as follows:

[0051] Sample 1): Si 3 N 4 (200nm) / Si 3 N 4 (200nm) / PEN;

[0052] Sample 2): Si 3 N 4 (200nm) / IZO (30nm) / Si 3 N 4 (200nm) / PEN;

[0053] Sample 3): Si 3 N 4 (200nm) / IZO (30nm) / Si 3 N 4 (200nm) / IZO (30nm) / Si 3 N 4 (200nm) / IZO (30nm) / Si 3 N 4 (200nm) / PEN.

[0054] where Si 3 N 4 The film was deposited by PECVD equipment, the film deposition temperature was 80 °C, the power was 150 W, and NH 3 , N 2 、SiH 4 mixed gas as the reaction gas.

[0055] The Mocon (Aquatran® Model 2) method was used to measure the water-oxygen barrier coefficient WVTR performance at 38°C and 100% relative humidity.

[0056] The WVTR test results and SEM images of the three samples are as follows: Figure 2 to Figure 8 shown.

[0057] The WVTR test value of sample 1 is 1.3...

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Abstract

The invention relates to a water-oxygen blocking film for a flexible film electronic device and a technology for adopting the water-oxygen blocking film as an electronic device package. The water-oxygen blocking film is a laminated film formed by staggered lamination of multiple blocking layers used for blocking water and oxygen molecules and multiple absorbing layers used for decoupling the structure and absorbing the water and oxygen molecules, and the blocking layers and the absorbing layers are all inorganic films; the composite film comprises a bottommost layer in contact with the device, a topmost layer in contact with the atmosphere and intermediate layers arranged between the bottommost layer and the topmost layer, both the bottommost layer and the topmost layer are the blocking layers, and any two adjacent layers forming the composite film are one blocking layer and one absorbing layer respectively. The blocking layers are at least one kind of SiO2 films, Si3N4 films, SiON films and Al2O3 films. The absorbing layers are metal oxide films or nitride films with amorphous structures. The water-oxygen blocking film is simple in structure and can obtain good water-oxygen blocking performance under the condition of thinness.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic devices, in particular to a water-oxygen barrier film for flexible thin-film electronic devices and a packaging process thereof. Background technique [0002] In order to ensure the effectiveness of the performance of flexible semiconductor thin film electronic devices, it is usually necessary to encapsulate the thin film functional bodies of flexible semiconductor thin film electronic devices during use. Existing packaging technologies usually consist of multiple layers of materials stacked to achieve a good water-oxygen isolation effect by taking advantage of the advantages of different materials. [0003] The currently used material systems are mainly: inorganic / organic hybrid multilayer films; in the structure of inorganic / organic hybrid multilayer films, inorganic films (such as Si 3 N 4 , Al 2 o 3 etc.) have a good water-oxygen barrier effect and play a major role in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/28H01L21/56
Inventor 徐苗李民陶洪李洪濛邹建华王磊彭俊彪
Owner GUANG ZHOU NEW VISION OPTO ELECTRONICS TECH
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