The invention provides a method for manufacturing a self-aligned metal-oxide film transistor. First, a metal source drain region, a metal-oxide semiconductor channel region and a transparent gate medium layer are sequentially arranged on a glass substrate, then positive photoresist is coated on the gate medium layer, after pre-baking is carried out, exposure, developing and hardbaking are carried out from the back of the glass substrate, afterwards, a layer of conductive film develops with glue, then a gate electrode is obtained after stripping the photoresist and the conductive film, photoetching and etching. The method of the invention can ensure self alignment between the gate electrode and the source drain region of a component, namely, the gate electrode is symmetrically arranged right above between the source and the drain, while, length of the gate electrode is determined by the distance between the source and the drain instead of size of a mask, thus effectively avoiding ghost effect.