Flip chip LED integrated light source structure and preparation method thereof

Abstract

The invention discloses a flip chip LED integrated light source structure. The structure comprises a prefabricated base plate, and a flip chip which is soldered to the prefabricated based plate by reflow soldering; the prefabricated base plate comprises an aluminum nitride ceramics layer, a copper-coated circuit layer a common reflection layer in a reflecting area, and an electrode bonding pad which are disposed on the aluminum nitride ceramics layer,; a white silicon reflecting layer covers the common reflection layer; and soldering tin is preadded on a flip chip electrode before reflow soldering. The flip chip -LED integrated light source structure and the preparation method have the advantages that the luminance attenuation of the flip chip integrated light source caused by the yellowing of the common reflection layer due to high-temperature eutectic reflow soldering in the prior art can be effectively prevented, and the vulcanization and oxidizing caused by silver plating in the prior art can also be effectively prevented; holes in the soldering tin are decreased after reflow soldering, so that the thermal resistance of the soldering tin structure can be effectively reduced; the thermal resistance in combination of an LED integrated light source and a radiator is reduced; and heat can be effectively exported to the radiator.

Description

technical field [0001] The invention relates to the field of lighting, in particular to a flip-chip LED integrated light source structure. Background technique [0002] In the past, the LED flip-chip integrated light source (or called flip-chip COB), the first manufacturing method is to weld the flip-chip to the prefabricated substrate of the LED integrated light source through gold-tin eutectic (AuSn 80 / 20) reflow soldering (see Figure 1). Using this structure has the following problems: gold-tin eutectic reflow soldering is through solid crystal, and then high-temperature (>283C) reflow soldering is performed on the gold-tin eutectic pre-coated on the flip chip electrode, so that the flip chip and the prefabricated substrate are combined. Therefore, when the reflective material in the reflective area of ​​the flip-chip integrated light source is an ordinary reflective material, that is, the white ink solder mask (Liquid photoimageable solder mask), the yellowing of the...

AI Technical Summary

Problems solved by technology

Using this structure has the following problems: Gold-tin eutectic reflow soldering is through solid crystal, and then high-temperature (>283C) reflow soldering is performed on the gold-tin eutectic pre-coated on the flip chip electrode, so that the flip chip and the prefabricated substrate are combined

Using this structure has the following problems: Solder paste reflow soldering is to use stencil printing solder paste on the chip electrode of the prefabricated substrate, and then through solid crystal and eutectic reflow soldering, so that the flip chip and the prefabricated substrate are combined

May become the heat conduction bottleneck of the overall flip-chip integrated light source and heat sink combination

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