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Hardening composition

A composition and compound technology, applied in the direction of electric solid device, semiconductor/solid device parts, coating, etc., can solve the problem that the encapsulant does not have heat resistance and light resistance.

Active Publication Date: 2015-03-11
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the encapsulants disclosed in the above references do not have sufficient heat resistance and light resistance

Method used

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  • Hardening composition
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Examples

Experimental program
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Effect test

Embodiment 1

[0177] A curable composition that can be cured by hydrosilylation is prepared by mixing compounds represented by formula A to formula D (mixing amount: formula A: 70 g, formula B: 200 g, formula C: 70 g, formula D: 4 g). Here, in the presence of a catalyst (for example, tetramethylammonium hydroxide (TMAH)), at about 115°C, a mixture of octamethylcyclotetrasiloxane and octaphenylcyclotetrasiloxane is combined with two The vinyl tetramethyl disiloxane is reacted for about 20 hours to prepare the polyorganosiloxane of formula A, and other compounds other than the polyorganosiloxane of formula A are prepared by known synthetic methods. Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed into the composition at a content of 10ppm Pt(0), and 20g Hollow imogolites with an outer diameter of about 2 mm and a length of about 400 nm are uniformly mixed to prepare a curable composition.

[0178] [Formula A]

[0179] (ViMe 2 SiO 1 / 2 ) 2 (Me 2 SiO 2 / 2 ) ...

Embodiment 2

[0187] A curable composition that can be cured by hydrosilylation is prepared by mixing compounds represented by formulas E, F, C and D (mixing amount: formula E: 70 g, formula F: 200 g, formula C: 70 g, formula D: 4 g) . Here, in the presence of a catalyst such as tetramethylammonium hydroxide (TMAH), a mixture of octamethylcyclotetrasiloxane and tetramethyltetraphenylcyclotetrasiloxane is combined with divinyltetrasiloxane The methyldisiloxane is reacted to prepare the polyorganosiloxane of formula E, and the compounds other than the polyorganosiloxane of formula E are prepared by known synthetic methods. Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed into the composition at a content of 10ppm Pt(0), and approximately 20 g of hollow hallucinite with an inner diameter of about 50 mm and a length of about 8,000 nm was uniformly mixed to prepare a curable composition.

[0188] [Formula E]

[0189] (ViMe 2 SiO 1 / 2 ) 2 (PhMeSiO 2 / 2 ) 26 (...

Embodiment 3

[0197] A curable composition that can be cured by hydrosilylation is prepared by mixing compounds represented by formulas G, H, C and D (mixing amount: formula G: 70 g, formula H: 200 g, formula C: 70 g, formula D: 4 g) . Here, using a catalyst such as tetramethylammonium hydroxide (TMAH), at an appropriate temperature, by making octamethylcyclotetrasiloxane, octaphenylcyclotetrasiloxane, and octaphenyl-polyhedron low A mixture of polysilsesquioxane (octaphenyl-POSS) and divinyltetramethyldisiloxane is reacted to prepare polyorganosiloxane of formula G, and other compounds are prepared by known synthetic methods. Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed into the composition at a content of 10ppm Pt(0), and approximately 20 g of hollow hallucinite with an inner diameter of about 30 mm and a length of about 10,000 nm was uniformly mixed to prepare a curable composition.

[0198] [Formula G]

[0199] (ViMe 2 SiO 1 / 2 ) 2 (Me 2 SiO 2 / ...

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Abstract

The present invention relates to a curable composition and a use thereof. The curable composition of an example has excellent processability and workability. The curable composition shows excellent light extraction efficiency, hardness, thermal shock resistance, moisture resistance, gas permeability, and adhesive properties after being hardened. The curable composition offers stable durability and reliability for a long time even in severe conditions, and enables users to provide a cured product without whitening and sticky surface.

Description

Technical field [0001] This application relates to a curable composition and its use. Background technique [0002] Light emitting diodes (LEDs), for example, particularly blue or ultraviolet (UV) LEDs emitting wavelengths of about 250 nm to 550 nm, are high-brightness products using GaN-based compound semiconductors such as GaN, GaAlN, InGaN, or InAlGaN. In addition, a high-quality full-color image can be formed by combining a red LED and a green LED with a blue LED. For example, there is known a technology for preparing white light LEDs by combining blue or ultraviolet LEDs with fluorescent substances. [0003] Such LEDs are widely used as backlights of liquid crystal displays (LCDs) or for illumination. [0004] Epoxy resins with high adhesive strength and excellent mechanical durability are widely used as LED encapsulants. However, epoxy resins have low light transmittance in the blue or ultraviolet region, and low heat and light resistance. For example, Patent Documents 1-3 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08G77/04H01L23/29G02F1/1335
CPCC08G77/12C08G77/20C08L83/04C08G77/80C09D183/04H01L33/56C08L83/00
Inventor 高敏镇郑宰昊崔范圭柳民儿
Owner LG CHEM LTD
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