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Method for forming metallization pattern by jet printing and molded interconnection assembly thereof

A technology of metallization patterns and jet printing, which is applied in chemical instruments and methods, metal layered products, replication/marking methods, etc., can solve the problems of lack of precious metal catalyst inks, etc., and achieve uniform noble metal catalyst layers, large surface area, and increased activity Effect

Inactive Publication Date: 2018-01-19
张益诚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although these disclosed technologies have disclosed the method of making metallized patterns by jet printing, they still lack the composition of the noble metal catalyst ink to avoid the noble metal catalyst ink from clogging and stabilize the pH value. The catalyst ink should be able to match the electroless plating method, so that the composition or temperature of the electroless plating solution will not damage the precious metal catalyst ink, so that the adhesion of the metallized pattern meets the practical needs and other technologies

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  • Method for forming metallization pattern by jet printing and molded interconnection assembly thereof
  • Method for forming metallization pattern by jet printing and molded interconnection assembly thereof
  • Method for forming metallization pattern by jet printing and molded interconnection assembly thereof

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Embodiment Construction

[0063] The following are examples, but the contents of the present invention are not limited to the scope of these examples.

[0064] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description with reference to the drawings and embodiments.

[0065] See figure 2 and 3 , figure 2 It is a step diagram of the method for forming a metallized pattern by jet printing in the present invention, image 3It is a schematic diagram of the method of forming a metallized pattern by spray printing in the present invention. The method of the present invention is to cover the plastic, glass or ceramic plastic mold component 2 substrate 21 with a patterned metal pattern with good adhesion and stability. layer 4, or further form a conductive layer 5 on the metal pattern layer 4 to make a metallized pattern molded interconnection component 1; wherein, when the material of the base material sel...

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Abstract

The invention relates to a method for forming a metallization pattern by spray printing and its molded interconnection assembly, wherein the method for forming a metallization pattern by spray printing includes using a mechanical method or a chemical method to modify the surface of a non-metallic substrate, using Noble metal catalyst ink with catalytic metal particles attached to the temperature-sensitive polymer. The metallized pattern is coated on the surface of the modified substrate by jet printing, and then the metal is formed on the part of the jet-printed noble metal catalyst ink by electroless plating. Metallized pattern, in which the precious metal catalyst ink uses a viscosity regulator to adjust its viscosity and surface tension, and uses a temperature-sensitive polymer to improve the adhesion between the metallized pattern and the substrate. The present invention also discloses forming a metallization pattern on a plastic mold component by means of the aforementioned spray printing method to form a metallization pattern to form a 2D or 3D plastic mold interconnection component, which is used in RFID, mobile communication device casings, and automotive electronics. components, three-dimensional LED components, etc.

Description

technical field [0001] The present invention relates to a method for forming a metallization pattern by spray printing and its molded interconnection assembly, especially using a temperature-sensitive polymer noble metal catalyst ink to form a metallization pattern by spray printing and electroless plating to manufacture Formed in a molded interconnect device. Background technique [0002] Short, thin and light digital communication electronic components have become the focus of today's technological development, so the production technology of many metallized circuits has become the main axis of the development of digital communication electronic products; now smart phones have changed the mainstream design mode of traditional mobile phone parts, in the "mobility" Under the concept of mobile demand and further space-saving requirements, the mobile phone transceiver antenna parts based on printed circuit boards in the past are no longer suitable for use, and the 3D metallize...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41M5/00B41M1/22B32B15/08B32B33/00
Inventor 葛明德张章平刘益铭粘晏瑜王柏强
Owner 张益诚