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Magnetic tunnel junction and method of forming the same

A magnetic tunnel junction and magnetic layer technology, which is applied in the manufacture/processing of components of electromagnetic equipment, resistors controlled by magnetic fields, and electromagnetic devices, can solve the problems of unstable storage performance and low reliability of magnetic random access memory, etc. Improve storage performance, stability, and reliability

Active Publication Date: 2017-02-22
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the storage performance of existing magnetic tunnel junctions is unstable, resulting in low reliability of MRAMs

Method used

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  • Magnetic tunnel junction and method of forming the same
  • Magnetic tunnel junction and method of forming the same

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Embodiment Construction

[0036] As mentioned in the background art, the storage performance of the existing magnetic tunnel junction is unstable, resulting in low reliability of the magnetic random access memory.

[0037] In order to improve storage performance, reduce noise, and increase storage capacity, a ring-shaped magnetic tunnel junction is proposed, please refer to figure 2 , figure 2 It is a three-dimensional schematic diagram of the magnetic structure in the annular magnetic tunnel junction structure, including: a fixed magnetic layer 120; a tunnel insulating layer 121 located on the surface of the fixed magnetic layer 120; a free magnetic layer 122 located on the surface of the tunnel insulating layer 121; wherein, the The fixed magnetic layer 120, the insulating layer 121 and the free magnetic layer 122 are all circular, that is, the inner and outer wall patterns of the fixed magnetic layer 120, the insulating layer 121 and the free magnetic layer 122 are all circular.

[0038] However, f...

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Abstract

A magnetic tunnel junction and its formation method, wherein the formation method of the magnetic tunnel junction includes: providing a first dielectric layer and a first electrode layer with a composite magnetic layer and a first mask layer on the surface in sequence, and the first mask layer is parallel The pattern on the surface of the substrate is circular; the composite magnetic layer is etched with the first mask layer until the first dielectric layer is exposed; then a second mask layer is formed on the surface of the first dielectric layer, and the surface of the second mask layer flush with the surface of the first mask layer; remove the first mask layer and form an opening; form a third mask side wall on the side wall surface of the opening; perform an ion implantation process on the third mask side wall, and the ion implantation The direction is tilted relative to the substrate surface; then, part of the third mask sidewall is etched to form a third mask, so that the inner sidewall of the third mask is parallel to the substrate surface and the pattern is elliptical; with the third mask The composite magnetic layer is etched until the first electrode layer is exposed. The formed magnetic tunnel junction has improved storage stability and improved reliability.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a magnetic tunnel junction and a forming method thereof. Background technique [0002] Magnetic Random Access Memory (MRAM) has the advantages of short read and write time, non-volatility, and low power consumption. It is suitable for information processing equipment such as computers or mobile phones, making magnetic memory widely concerned by the market. [0003] The existing magnetic memory structure includes: a transistor used as a switching device, and a magnetic tunnel junction (Magnetic Tunnel Junction, MTJ) structure used for storing data. Magnetic memory stores information into a magnetic tunnel junction structure by applying a magnetic field, and reads the stored information by measuring the current passing through the magnetic tunnel junction. [0004] figure 1 It is a schematic cross-sectional structure diagram of an existing magnetic tunnel junc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L43/12H01L43/08H01L43/02H10N50/01H10N50/10H10N50/80
Inventor 洪中山
Owner SEMICON MFG INT (SHANGHAI) CORP
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