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HDI circuit board and interlayer interconnection structure and machining method thereof

An interlayer interconnection and circuit board technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of complex manufacturing process and inability to realize thick copper HDI circuit boards, and achieve simplified manufacturing process and simple process. reliable results

Inactive Publication Date: 2015-03-25
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides an HDI circuit board and its interlayer interconnection structure and processing method, so as to solve the technical problems that the existing HDI technology cannot realize thick copper HDI circuit board and complicated manufacturing process

Method used

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  • HDI circuit board and interlayer interconnection structure and machining method thereof
  • HDI circuit board and interlayer interconnection structure and machining method thereof
  • HDI circuit board and interlayer interconnection structure and machining method thereof

Examples

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Embodiment 1

[0018] An embodiment of the present invention provides an interlayer interconnection structure of an HDI circuit board, which is used to realize the interlayer interconnection in the HDI circuit board.

[0019] Please refer to figure 1 , the HDI circuit board 100 is generally a multi-layer board, which includes an N-layer circuit layer 110, and a dielectric layer 120 between any two circuit layers. The dielectric layer 120 has a total of (N-1) layers, and N is greater than An integer of 2, specifically 3, 4 or more.

[0020] The interlayer interconnection structure includes: a metallized via hole 130 penetrating through the N-layer circuit layer 110, and a metal connection ring 140 or an insulating isolation ring processed on each circuit layer 110 surrounding the metallized via hole 110 150; of which,

[0021] The N-layer wiring layer 110 includes M-layer wiring layers that require interlayer interconnection, and each wiring layer 110 in the M-layer wiring layer 110 include...

Embodiment 2

[0032] An embodiment of the present invention provides an HDI circuit board, which includes N circuit layers and at least one interlayer interconnection structure as described in Embodiment 1, wherein N is an integer greater than 2.

[0033] For the case where the HDI circuit board includes only one interlayer interconnection structure, refer to Figure 1 to Figure 3 Shown and described in Example 1.

[0034] For the case where the HDI circuit board only includes two or more interlayer interconnection structures, the supplementary instructions are as follows:

[0035] First, each interlayer interconnection structure requires an independent metallized through hole. Assuming that there are Z interlayer interconnection structures, Z metallized through holes are required, and Z is a positive integer.

[0036] Second, the same line layer can exist in different interlayer interconnection structures. An example is as follows: naming the HDI circuit board includes N layers of circui...

Embodiment 3

[0043] Please refer to Figure 5 , the embodiment of the present invention provides a method for processing HDI circuit boards, for processing the interlayer interconnection structure of HDI circuit boards as described in Embodiment 1, the method comprising:

[0044] 210. Manufacture a multilayer board including N layers of copper foil, where N is an integer greater than 2, wherein the N-2 layers of copper foil on the inner layer have been processed into circuit patterns, and M layers of copper for interlayer interconnection are required Each of the foil layers has a metal area at a predetermined position, and each of the other (N-M) copper foil layers other than the M layer circuit layer has an insulating area at a predetermined position.

[0045] The process of making multi-layer boards can use conventional lamination and layering processes. The difference from the existing HDI manufacturing technology is that after each layering, there is no need to make metallized blind ho...

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Abstract

The invention discloses an interlayer interconnection structure of an HDI circuit board. The interlayer interconnection structure comprises a metallization through hole penetrating through the HDI circuit board and including N line layers, wherein M line layers required to be mutually connected comprise metal connecting rings surrounding the metallization through hole, the M line layers are mutually connected with the metallization through hole through the metal connecting rings, and the M is an integer and is greater than or equal to 2 but smaller than the N. The N-M line layers comprise insulating isolation rings surrounding the metallization through hole so that the N-M line layers cannot be mutually connected through the metallization through hole. The embodiment of the invention further provides the corresponding HDI circuit board and a machining method of the HDI circuit board. Due to the fact that the technical scheme is applicable to a thick copper circuit board with the copper thickness greater than that of 3OZ thickness, and a manufacturing process is simple and reliable.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an HDI circuit board, an interlayer interconnection structure and a processing method thereof. Background technique [0002] The development of HDI (High Density Interconnector, high-density interconnect or arbitrary layer interconnect) circuit boards is very rapid. The general HDI circuit board uses metallized blind holes to connect the various circuit layers that need to be connected. The diameter is generally not greater than 0.2mm; then, use laser ablation to remove the dielectric layer below the blind hole to form a blind hole that reaches the upper copper foil layer; then, metallize the blind hole to realize the two layers of copper foil Then, you can continue to build up layers, and make metallized blind holes in the same way after layering up to realize the interconnection between other layers. [0003] During the research and practice of the prior art, the inven...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/42H05K3/40
CPCH05K1/116H05K3/42H05K2201/09454
Inventor 黄立球刘宝林
Owner SHENNAN CIRCUITS
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