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Post-dip solution and post-dip method for electroless nickel-gold plating of circuit board

A technology for electroless nickel-plating gold and circuit boards, applied in liquid chemical plating, printed circuit, printed circuit manufacturing, etc., can solve problems such as missing plating, achieve simple process, low incidence of missing plating, and improve efficiency

Active Publication Date: 2017-10-10
WUHAN CHUANGXINTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, provide a kind of circuit board electroless nickel-plated gold back immersion solution and post-dipping method, to solve the half plug hole of existing high-density printed circuit board in chemical nickel-plated gold The technical problem of missing plating phenomenon

Method used

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  • Post-dip solution and post-dip method for electroless nickel-gold plating of circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0035] This embodiment provides a post-immersion solution for electroless nickel-gold plating on a circuit board, a post-dipping method for electroless nickel-gold plating on a circuit board, and a high-density printed circuit board. Wherein, the post-immersion solution of the electroless nickel-gold plating of the circuit board comprises the components of the following concentration content:

[0036] Sulfuric acid (98%): 3% (V / V)

[0037] Ascorbic acid: 10g / l

[0038] Gluconic acid: 30g / l

[0039] Deionized water: balance.

[0040] The post-dipping method of electroless nickel-plated gold on the circuit board comprises the following steps:

[0041] The circuit board after the activation treatment is placed in the post-immersion solution of the above-mentioned embodiment for post-dip treatment, wherein the process conditions of the post-dip treatment are: the temperature is 30° C., and the treatment time is 90 seconds.

[0042] The high-density printed circuit board is a h...

Embodiment 2

[0044] This embodiment provides a post-immersion solution for electroless nickel-gold plating on a circuit board, a post-dipping method for electroless nickel-gold plating on a circuit board, and a high-density printed circuit board. Wherein, the post-immersion solution of the electroless nickel-gold plating of the circuit board comprises the components of the following concentration content:

[0045] Sulfuric acid (98%): 3% (V / V)

[0046] Ascorbic acid: 10g / l

[0047] Malic acid: 20g / l

[0048] Gluconic acid: 20g / l

[0049] Deionized water: balance.

[0050] The post-dipping method of electroless nickel-plated gold on the circuit board comprises the following steps:

[0051] The circuit board after the activation treatment is placed in the post-immersion solution of the above embodiment for post-dip treatment, wherein the process conditions of the post-dip treatment are: the temperature is 20° C., and the treatment time is 120 seconds.

Embodiment 3

[0053] This embodiment provides a post-immersion solution for electroless nickel-gold plating on a circuit board, a post-dipping method for electroless nickel-gold plating on a circuit board, and a high-density printed circuit board. Wherein, the post-immersion solution of the electroless nickel-gold plating of the circuit board comprises the components of the following concentration content:

[0054] Sulfuric acid (98%): 3% (V / V)

[0055] Ascorbic acid: 10g / l

[0056] Gluconic acid: 10g / l

[0057] Deionized water: balance.

[0058] The post-dipping method of electroless nickel-plated gold on the circuit board comprises the following steps:

[0059] The circuit board after the activation treatment is placed in the post-immersion solution of the above-mentioned embodiment for post-dip treatment, wherein the process conditions of the post-dip treatment are: the temperature is 40° C., and the treatment time is 60 seconds.

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Abstract

The invention discloses a post-immersing liquid of circuit board electroless nickel immersion gold. The post-immersing liquid comprises the components of 1 to 10V / V% of sulfuric acid, 1 to 30g / L of a reducing agent and 10 to 80g / L of a complexing agent. According to the post-immersing liquid of the invention, the reducing agent and the complexing agent are added so as to modify the post-immersing liquid, so that oxidation substances such as micro etching solution, Cu<2+> and activated Pd<2+> left in semi-plugged holes can be removed, and therefore, plating omission in the electroless nickel immersion gold can be avoided, and the yield of high-density printed-circuit boards can be improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a post-immersion solution for electroless nickel-gold plating on circuit boards, a post-dip method and a circuit board. Background technique [0002] In recent years, with the increasingly fierce competition of communication products, the printed circuit board PCB manufacturing industry has also developed rapidly, especially tending to the production of high-density printed circuit boards. Compared with ordinary printed circuit boards, the line width and line spacing of high-density printed circuit boards are getting smaller and smaller, the pitch of connecting terminals is shrinking, the hole diameter is also getting smaller and smaller, and plug holes are required. The development of these technologies has great impact on The surface treatment process requirements of printed circuit boards have been further improved. Some process technologies that can meet the pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18C23C18/18C23C18/32
CPCC23C18/1851C23C18/34H05K3/181H05K2203/072
Inventor 陈兵
Owner WUHAN CHUANGXINTE TECH CO LTD