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Monitoring of buckle thickness and pressure control

A buckle and controller technology, applied in the control of workpiece feed movement, manufacturing tools, semiconductor/solid-state device manufacturing, etc., can solve problems such as buckle wear, and achieve the effect of reducing operating costs and improving lifespan.

Active Publication Date: 2018-02-13
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the friction created by the abrasive pad on the bottom surface of the buckle, the buckle will generally wear out and need to be replaced

Method used

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  • Monitoring of buckle thickness and pressure control
  • Monitoring of buckle thickness and pressure control
  • Monitoring of buckle thickness and pressure control

Examples

Experimental program
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Embodiment Construction

[0021] figure 1 An example of the grinding device 100 is described. The grinding device 100 includes a rotatable disc-shaped plate 120 on which a grinding pad 110 is disposed. The plate 120 is operable to rotate about an axis 125 . For example, the motor 121 can turn the drive shaft 124 to rotate the tablet 120 . The polishing pad 110 can be a double-layer polishing pad, which has an outer polishing layer 112 and a softer backing layer 114 .

[0022] The polishing device 100 may include a port 130 for distributing a polishing liquid 132 such as a polishing slurry onto the polishing pad 110 . The polishing device 100 may also include a polishing pad conditioner to polish the polishing pad 110 to maintain a consistent polishing state of the polishing pad 110 .

[0023] The grinding device 100 includes one or more carrier heads 140 . Each carrier head 140 is operable to hold a substrate 10 against the polishing pad 110 . Each carrier head 140 may have independent control of...

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PUM

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Abstract

A chemical mechanical polishing apparatus includes a carrier head, an in-situ monitoring system, and a controller. The carrier head includes a retaining ring having a plastic portion having a bottom surface in contact with a polishing pad. The in-situ monitoring system includes a sensor that generates a signal based on the thickness of the plastic portion, the controller configured to receive the signal from the in situ monitoring system, and adjust at least one grinding parameter in response to the signal to compensate for changes in the thickness of the plastic portion of the buckle Change the resulting non-uniformity.

Description

technical field [0001] The present disclosure relates to monitoring ring thickness, for example, during chemical mechanical polishing. Background technique [0002] Integrated circuits are generally formed by sequentially depositing conductive layers, semiconductor layers, or insulator layers on silicon wafers. One fabrication step involves depositing a filler layer on a non-planar surface and planarizing the filler layer. For some applications, the filler layer is planarized until the top surface of the patterned layer is exposed. For example, a conductive filler layer may be deposited on the patterned insulating layer to fill trenches and holes in the insulating layer. After planarization, the remaining portions of the conductive layer between the raised patterns of the insulating layer form through-holes, joints and wires, providing multiple conductive paths between the thin film circuits on the substrate. For other applications, such as oxide grinding applications, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304H01L21/66
CPCB24B37/005B24B37/30B24B49/105
Inventor S·德什潘德Z·王S·C-C·徐G·S·丹达瓦特H·C·陈W-C·屠
Owner APPLIED MATERIALS INC