Preparation method of single-layer nano-metal grating

A nano-metal and nano-grating technology, which is applied in the field of nano-manufacturing, can solve the problems of difficult control of graphic side erosion, many process steps, and high process difficulty, and achieve the effects of low cost, simplified process steps, and high graphic resolution

Inactive Publication Date: 2015-04-08
DALIAN UNIV OF TECH
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  • Abstract
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  • Claims
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Problems solved by technology

Lebib A of the French National Academy of Sciences and others used nanoimprinting and lift-off techniques to fabricate a single-layer metal nano-pattern structure (Lebib A, Chen Y, Carcenac F, Cambril E, Manin L, Couuraud L and Launois H. Tri-layer systems for nanoimprint lithography with an improved process latitude.Microelectron.Eng.2000,53(1-4):175-178), this process has many steps, the dry etching process of PMGI material is difficult, and the pattern side etching is difficult to control At the same time, the thickness of PMGI material also limits the height of the fabricated metal nanopatterns

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  • Preparation method of single-layer nano-metal grating
  • Preparation method of single-layer nano-metal grating
  • Preparation method of single-layer nano-metal grating

Examples

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Embodiment 1

[0027] A method for preparing a single-layer nano-aluminum grating, the preparation method comprising the steps of:

[0028] ①The substrate is spin-coated with imprinting glue first, and then the imprinting template with nano-grating pattern is pressed into the imprinting glue. Using ultraviolet nano-imprinting, the nano-pattern is transferred, the imprinting template and the substrate are separated, and the imprinting glue is formed and embossed. The nano-grating pattern complementary to the imprint template structure, that is, the imprint adhesive layer of the one-dimensional nano-grating structure is obtained, and finally the imprint residual adhesive layer is removed by oxygen reactive ion etching technology;

[0029] ②A 90nm aluminum layer is deposited on the side with the nano-grating pattern on the substrate by thermal evaporation, an upper aluminum nano-grating layer is formed on the embossed adhesive layer, and a lower aluminum nano-grating layer is formed on the subst...

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Abstract

The invention relates to a preparation method of a single-layer nano-metal grating and belongs to the technical field of nano-manufacturing. The preparation method comprises the steps of 1) firstly coating imprinting adhesive on a substrate, then pressing an imprinting template with a nano-grating pattern into the imprinting adhesive to obtain an imprinting adhesive layer of a one-dimensional nano-grating structure, and finally removing residual imprinting adhesive; 2) depositing a metal layer on one side, with the nano-grating pattern, of the substrate, forming an upper layer metal nano-grating layer on the imprinting adhesive layer, and forming a lower layer metal nano-grating layer on the substrate; 3) removing the imprinting adhesive layer to obtain the single-layer nano-metal grating. The preparation method of the single-layer nano-metal grating has the beneficial effects that the process steps are simple, the operation is easy to perform, the cost is low, the manufacturing cycle is short and the preparation method is suitable mass production.

Description

technical field [0001] The invention relates to a preparation method of a single-layer nanometer metal grating, which belongs to the technical field of nanometer manufacturing. Background technique [0002] Single-layer nano-metal grating plays an important role in the field of optics and nano-processing technology. In the field of optics, polarizers with single-layer nano-metal gratings have the advantages of high extinction ratio, high light transmittance, wide spectrum adaptability and stable performance, and are important devices in the field of polarization optics. In the field of nanofabrication technology, due to dry etching processes such as reactive ion etching (Reactive Ion Etching, RIE) and inductively coupled plasma etching (Inductively Coupled Plasma etching, ICP). Semiconductor materials have a high etching ratio, and are the preferred concealing layer materials for dry etching processing of nano-grating structures with high aspect ratios. [0003] At present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/18G03F7/00
CPCG02B5/1857G03F7/0002
Inventor 张然褚金奎刘泽王志文王倩怡
Owner DALIAN UNIV OF TECH
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