Heat conduction and load bearing integrated light sandwiched panel with lattice structure and preparation method thereof
A lattice structure, sandwich panel technology, applied in chemical instruments and methods, lamination devices, lamination and other directions, can solve the problems of poor thermal conductivity, single structural performance, etc., to improve thermal conductivity, reduce contact thermal resistance, high Effect of Shear Specific Strength and Specific Stiffness
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2015-04-29
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a lightweight lattice structure sandwich panel and a preparation method thereof. Background technique
[0002] Lightweight sandwich structures have been widely used in aerospace and other fields due to their advantages of high specific strength and specific stiffness. At present, the common lightweight sandwich structures are lattice structures and lattice structures. The honeycomb sandwich structure (hexagonal grid structure) is the most common sandwich structure in modern satellite structures. The sandwich structure is a periodic porous structure, the core has large pores, closed space (such as honeycomb, grid, etc.), the structure has poor heat dissipation capacity, poor thermal conductivity, and the thermal conductivity is lower than 2W / (m·K). The aerospace field puts forward higher design requirements for the function of the sandwich structure, not only requires lightweight, but also requires multi-functional integration...
Examples
specific Embodiment approach 1
[0031] Embodiment 1: A light-weight lattice structure sandwich panel integrating heat conduction and load bearing in this embodiment is composed of an upper panel 1, a lattice structure sandwich layer 2 and a lower panel 3;
[0032] The lattice structure sandwich layer 2 is composed of an upper reinforcement net 4, a plurality of pyramidal lattice structure unit cells 5, a lower reinforcement net 6 and a carbon foam sandwich panel 8;
[0033] The unit cell 5 of the pyramid lattice structure is formed by four independent round rods 7 arranged in a pyramid shape;
[0034] The upper reinforcing net 4 and the lower reinforcing net 6 are metal mesh panels with elliptical notches and hollowed out, each group of four elliptical notches is a group, and each group of elliptical notches is distributed in a grid. Each group of elliptical notches is set at the intersection of the structure, and the elliptical notches are through holes, and the inside of the grid of the grid structure is s...
specific Embodiment approach 2
[0038] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the upper panel 1 is a carbon fiber reinforced polymer matrix composite material plate or a thin metal plate. Other steps and parameters are the same as those in the first embodiment.
specific Embodiment approach 3
[0039] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the lower panel 3 is a carbon fiber reinforced polymer matrix composite material plate or a thin metal plate. Other steps and parameters are the same as those in Embodiment 1 or 2.