Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High anti-impact waterproof and dampproof composite board

A high-impact, composite board technology, applied in the direction of synthetic resin layered products, paper/cardboard layered products, layered products, etc., can solve the problems of unsuitable light packaging, the impact of waterproof and moisture resistance, and poor impact resistance of boards, etc. problems, to achieve good environmental characteristics, low cost, and excellent impact resistance

Active Publication Date: 2015-04-29
正业包装(中山)有限公司
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary honeycomb paperboard is difficult to meet
For example, patent CN102991076A discloses a waterproof and moisture-proof carton board structure, which adopts a waterproof film, a polymer waterproof layer and a silica gel waterproof layer in the multi-layer cardboard to achieve the effect of waterproof and moisture-proof, but the impact resistance of the board itself is relatively low. Poor, prone to deformation, if the cardboard itself is damaged, it will undoubtedly have a great impact on its waterproof and moisture resistance
Patent CN104057678A discloses a high wear-resistant, waterproof and moisture-proof composite board and its preparation method and application, but it is mainly for the manufacture of composite wood boards, which are heavy and not suitable for light packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High anti-impact waterproof and dampproof composite board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] refer to figure 1 , propose an embodiment of a high-impact waterproof and moisture-proof composite board of the present invention:

[0029] A high-impact waterproof and moisture-proof composite board is composed of multi-layer materials, including an upper structure, a lower structure and a honeycomb paperboard layer 1 arranged between the upper structure and the lower structure. The upper layer structure includes, from top to bottom, the upper wear-resistant plastic film layer 5-1, the upper inorganic fiber coating III6-3, the upper cardboard foam layer 4-1, the upper waterproof film layer 3-1, and the upper inorganic fiber coating II6 -2. The upper high-impact fiber layer 2-1 and the upper inorganic fiber coating I6-1, the lower layer structure from bottom to top includes the lower wear-resistant plastic fil...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a high anti-impact waterproof and dampproof composite board which is composited by multiple layers of materials. The high anti-impact waterproof and dampproof composite board comprises an upper structure, a lower structure and a honeycomb paperboard layer which is arranged between the upper structure and the lower structure, wherein the upper structure sequentially comprises an upper wear-resistant plastic film layer, an upper paperboard foaming layer, an upper waterproof film layer and an upper high anti-impact fiber layer from top to bottom; the lower structure sequentially comprises a lower wear-resistant plastic film layer, a lower paperboard foaming layer, a lower waterproof film layer and a lower high anti-impact fiber layer from bottom to top; the upper and lower paperboard foaming layers are panels by foaming paper fibers, polylactic acid, aliphatic polyester and a thermoplastic elastomer as main materials which are mixed. The composite board has excellent anti-impact and waterproof and dampproof properties, is simple in manufacturing process, easy to obtain raw materials and low in cost, can be widely applied in the field of high-grade packages, effectively reduces the thickness of the packaged products and improves the performance.

Description

technical field [0001] The invention relates to the field of composite cardboard, in particular to a high-impact, waterproof and moisture-proof composite board that has excellent impact resistance and is waterproof and moisture-proof. Background technique [0002] In the field of packaging boards, high requirements are put forward for the cushioning properties of the boards. It is necessary for the packaging boards to remain undamaged under strong impact. As the most widely used packaging material in recent years, honeycomb paperboard has good cushioning properties, but It is prone to deformation under long-term large static pressure. At the same time, with the improvement of packaging requirements, more and more products require the packaging to have certain waterproof and moisture-proof characteristics to protect the quality of the inner packaging. Ordinary honeycomb cardboard is difficult to meet. For example, patent CN102991076A discloses a waterproof and moisture-proo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/12B32B27/06B32B5/18B32B33/00B32B5/22
CPCB32B3/12B32B5/10B32B5/18B32B29/06B32B33/00B32B2260/046B32B2262/06B32B2307/558B32B2307/7265
Inventor 罗礼发尹文欣李俊陈一
Owner 正业包装(中山)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products