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Unpacking method of plastic-encapsulated devices

A device and component technology, applied in the field of unsealing electronic components, can solve problems such as low tolerance, and achieve the effect of improving the success rate and uniform corrosion rate

Active Publication Date: 2017-06-30
CASIC DEFENSE TECH RES & TEST CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conventional method of unsealing can only acid-etch the limited area in the middle, usually the surrounding area is not completely exposed, but the middle area has been corroded, and a single corrosive liquid is used, which is likely to cause the lowest tolerance of components (such as inductors, resistors, etc.) Corrosion occurred first, such as figure 2 shown

Method used

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  • Unpacking method of plastic-encapsulated devices
  • Unpacking method of plastic-encapsulated devices
  • Unpacking method of plastic-encapsulated devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] As an embodiment of the present invention, taking the LTM series plastic packaging device of LINEAR Company as an example, the unsealing method of the plastic packaging device includes the following steps:

[0033] 1. Before unpacking, use X-ray inspection method to locate the position and depth of each component and chip inside the plastic packaged device, and obtain the size, position and depth information of each component and chip inside the device, such as image 3 shown. Under normal circumstances, unpacking only needs to expose the internal chip, inductor and resistance capacitor, so it is only necessary to remove the encapsulation material on the surface of these components and the chip.

[0034] 2. According to the size, position and depth information of each component and chip inside the plastic packaged device obtained in step 1, the plastic packaged device is unsealed by laser ablation to remove the encapsulation material 101 on the surface of the plastic pa...

Embodiment 2

[0043] As an embodiment of the present invention, taking the LTM series plastic packaging device of LINEAR Company as an example, the unsealing method of the plastic packaging device includes the following steps:

[0044] 1. Before unpacking, use X-ray inspection method to locate the position and depth of each component and chip inside the plastic packaged device, and obtain the size, position and depth information of each component and chip inside the device, such as image 3 shown. Under normal circumstances, unpacking only needs to expose the internal chip, inductor and resistance capacitor, so it is only necessary to remove the encapsulation material on the surface of these components and the chip.

[0045] 2. According to the size, position and depth information of each component and chip inside the plastic packaged device obtained in step 1, the plastic packaged device is unsealed by laser ablation to remove the encapsulation material 101 on the surface of the plastic pa...

Embodiment 3

[0054] As an embodiment of the present invention, taking the LTM series plastic packaging device of LINEAR Company as an example, the unsealing method of the plastic packaging device includes the following steps:

[0055] 1. Before unpacking, use X-ray inspection method to locate the position and depth of each component and chip inside the plastic packaged device, and obtain the size, position and depth information of each component and chip inside the device, such as image 3 shown. Under normal circumstances, unpacking only needs to expose the internal chip, inductor and resistance capacitor, so it is only necessary to remove the encapsulation material on the surface of these components and the chip.

[0056] 2. According to the size, position and depth information of each component and chip inside the plastic packaged device obtained in step 1, the plastic packaged device is unsealed by laser ablation to remove the encapsulation material 101 on the surface of the plastic pa...

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Abstract

The invention discloses a method for unsealing a plastic-encapsulated device, which includes: firstly positioning the position and depth of each component and chip inside the plastic-encapsulated device, and obtaining information on the size, position and depth of each component and chip inside the device; adopting laser ablation The method unseals the plastic-encapsulated device to remove the encapsulation material on the surface of the plastic-encapsulated device, so that the inner wire bonding wire is just exposed in the chip area, the tin-lead solder joint is just exposed near the resistance capacitor, and the inductance is just exposed near the inductor; The aluminum foil is used to mask the ablated plastic-encapsulated device, so that the area that does not need to be etched is masked by the aluminum foil, and then an etchant is used to locally corrode the masked plastic-encapsulated device. This method can more accurately control the unsealing depth of each local area of ​​the plastic-encapsulated device and the properties of the corrosive liquid, achieve precise control of multi-point, layer-by-layer unsealing effects, and can better solve the difficult problem of unsealing the plastic-encapsulated hybrid integrated circuit by traditional methods.

Description

technical field [0001] The invention relates to the technical field of unsealing electronic components, in particular to an unsealing method for plastic-encapsulated devices. Background technique [0002] In the failure analysis of semiconductor devices, the device needs to be unpacked to expose the internal chips or components for subsequent analysis. However, with the development of packaging technology and level, the packaging methods and processes of electronic components have undergone revolutionary progress, and multi-layer and hybrid packaging plastic packaging devices have appeared. The existing acid unsealing method has good universality for plastic-encapsulated semiconductor devices with only one chip inside, but due to poor directionality and controllability of acid unsealing, plastic-encapsulated devices and multi-layer structures with multiple chips or components inside The unsealing of plastic-encapsulated devices cannot accurately control the multi-point, lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
CPCH01L2224/48091H01L2924/15311H01L2924/181H01L2924/19105
Inventor 王坦刘晓昱贺峤
Owner CASIC DEFENSE TECH RES & TEST CENT