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Continuous growth method of thin films at high temperature and under vacuum conditions

A thin film and vacuum technology, applied in the field of similar devices, can solve the problems of restricting film growth efficiency, small growth size of single film, long film growth period, etc.

Inactive Publication Date: 2015-05-20
CHANGZHOU TANWEI NANO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] ① The growth size of a single film is small
The films grown by PVD or CVD equipment commonly used in the industry are small in size (up to about 40cm), which cannot meet the market's demand for large-size films;
[0007] ② The number of films grown in a single batch is small, making mass production impossible;
[0008] ③ Film growth cycle is too long
[0009] In short, the above three defects in the film growth process are all factors that restrict the film growth efficiency.

Method used

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  • Continuous growth method of thin films at high temperature and under vacuum conditions

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Embodiment

[0021] Embodiment: continuous growth of graphene film under high temperature and vacuum:

[0022] 1. Close the slide valves (2), (3), and (4), pump the growth chamber (8) and the cooling chamber (9) to the required vacuum degree, and the heating member (6) heats the space surrounded by it to High temperature (1000 degrees Celsius) required for thin film growth;

[0023] 2. Open the gate valve (1), push the shelf (7) carrying the multi-layer Cu substrate into the preparation chamber (5) through the slide rail (10), close the gate valve (1), and evacuate to and When the vacuum degree of the growth chamber (8) is equal, open the slide valve (2), push the shelf (7) into the high-temperature zone, and the reaction gas (methane + hydrogen) enters the growth chamber (8) through the micro-leakage valve (18). During the film growth process, the preparatory chamber (5) can be inflated to atmospheric pressure at the same time, and then the second batch of shelves (19) loaded with substr...

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Abstract

The invention belongs to the field of thin film growth or thin film preparation, and particularly relates to the fields or similar devices of thin film preparation performed by using methods of deposition or jet plating and the like on a substrate. The invention provides a continuous growth method of thin films at a high temperature and under vacuum conditions, which solves the problem of prolonging the growth cycle caused by long air sucking and release time and slow heating / cooling speed and the like when thin films grow in a single cavity. When a batch of thin films flows out of the final end of a three-cavity assembly line, a batch of substrates flows in the initial end of the assembly line to carry out thin film growth, thereby avoiding the time consumption and energy consumption for repeated air sucking and release and heating / cooling. In addition, the size of a stainless steel cavity used in the invention is easily expanded, so that the stainless steel cavity can accommodate large-sized and multi-layered substrates, thereby greatly improving the output of thin films growing in a single batch.

Description

Technical field: [0001] The present invention relates to the field of thin film growth or thin film preparation, more specifically to the field of batch thin film preparation by depositing or sputtering on a substrate and similar devices. Background technique: [0002] Thin-film materials and related thin-film devices emerged in the 1960s and are the products of new theories and high-tech crystallization. With the rapid development of modern science and technology, many fields need to use a large number of new inorganic materials or thin film materials with different functions, such as graphene, hexagonal boron nitride and polymer thin films. The combination of thin film materials and components has become the core foundation of electronics, information, sensors, optics, solar energy and other technologies. Generally speaking, the preparation methods of thin film materials are nothing more than physical film forming method and chemical film forming method. [0003] Physica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/56C23C14/54C23C16/54C23C16/52
Inventor 董国材张祥刘进行王雷李金龙
Owner CHANGZHOU TANWEI NANO TECH
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