Manufacturing method of printed circuit board

Abstract

The present invention relates to a method for manufacturing a printed circuit board. The method is characterized by comprising the steps of preparing a base material on one surface of which a photosensitive anti-corrosion film is formed; by the exposure and development, removing an area in which a conductive pattern needs to be formed from the photosensitive anti-corrosion film; filling the conductive printing ink in the removed area of the photosensitive anti-corrosion film to form the conductive pattern; and removing the photosensitive anti-corrosion film. Therefore, compared with the prior art, a circuit pattern of more precise can be realized, the accuracy and electrical characteristic can be improved, and the metal substances do not leave on the base material, thereby improving the electrical characteristic and the reliability. When the conductive pattern is formed, the additional etching process is not needed, thereby saving the number of the processes, and preventing the environmental pollution caused by an etching liquid. Moreover, the present invention provides the method for manufacturing the printed circuit board without needing to worry about the broken line on the conditions that a double-face printed circuit board is bent, folded, or meets with the thermal shock or physical shock.

Description

technical field [0001] The present invention relates to a method for manufacturing a printed circuit board, and more specifically relates to a printed circuit board capable of forming precise and high-conductivity circuit patterns using a photosensitive resist film, saving raw materials and reducing the number of processes, etc. Production method. Background technique [0002] Generally speaking, a printed circuit board (Printed Circuit Board) is an electronic component in the form of a substrate on which various electronic components are loaded and electrically connected. [0003] According to the hard and soft materials of the substrate, printed circuit boards are divided into two categories: rigid printed circuit boards (Rigid Printed Circuit Board) and flexible circuit boards (Flexible Circuit Board). Recently, rigid and flexible composite printed circuit boards have appeared. [0004] In the initial stage of the application of printed circuit boards, products with rela...

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Problems solved by technology

[0022] However, the manufacturing method has a problem in that the manufacturing method needs to fill the through holes with the conductive paste while forming the printed circuit from the conductive paste by the printing method, but the printed circuit conductors are formed from the conductive paste that forms protrusions by filling the through holes. The printing method of the part is very limited. On the contrary, it is difficult to fill the through hole with the conductive paste that is easy to form a printed circuit to form a protrusion.

[0023] In addition, the flexible printed circuit board manufactured by the above-mentioned manufacturing method has the disadvantage that the connection part formed in the through hole may shrink or break under thermal or physical impact, and the possibility of disconnection is high, and in the process, it is necessary to Further increase the disadvantages of the process for forming an additional closing plate part to prevent the leakage of the conductive paste filled in the through hole, so it is not currently utilized in the industry

[0024] In addition, since the bonding force between the conductive paste layer and the base material is not sufficient, the interface between the printed circuit formed by the conductive paste and the protruding connecting conductor portion forming the through hole is often separated or detached, so it has not been substantially accepted at present. Practical

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