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PCB of power circuit for automobile instrument and design method of PCB

A technology for PCB boards and automotive instruments, applied in printed circuits, printed circuits, circuit thermal devices, etc., can solve problems such as low work efficiency, unfavorable production line production, unstable voltage output, etc., to improve work efficiency, prolong service life, The effect of increasing the heat dissipation rate

Inactive Publication Date: 2015-06-10
AEROSPACE HI TECH HLDG GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the power supply circuit for automobile instrumentation will cause unstable voltage output due to heating, and the use of heat sinks, screws, and nuts to fix the work efficiency is low, which is not conducive to the production of the production line. Now it provides a PCB board for the power supply circuit for automobile instrumentation. and its design method

Method used

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  • PCB of power circuit for automobile instrument and design method of PCB
  • PCB of power circuit for automobile instrument and design method of PCB
  • PCB of power circuit for automobile instrument and design method of PCB

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specific Embodiment approach 1

[0023] Specific implementation mode one: refer to figure 2 Describe this embodiment in detail, the PCB board of the power supply circuit for automobile instrument described in this embodiment, the pad of each heating element is covered with a large-area top layer copper clad layer 1, and the area of ​​the top layer copper clad layer 1 10 times larger than the pad area of ​​the heating element.

[0024] In the PCB board of the power supply circuit for automobile instrument described in this embodiment, the pads of each heating element are all covered with a large-area top layer copper clad layer 1. Since copper has good thermal conductivity, the number of pads connected to the heating element is increased. The area of ​​the copper layer can quickly dissipate the heat on the component to the connected copper layer, so that the heat will not accumulate on the component, effectively prevent the damage of the heating component due to the long working time and temperature rise, and...

specific Embodiment approach 2

[0025] Specific implementation mode two: see image 3 This embodiment will be described. This embodiment is a further description of the PCB board of the power supply circuit for automobile instrument described in Embodiment 1. In this embodiment, a plurality of via holes 2 are opened on the top copper clad layer 1 on the PCB, and there The bottom layer of the PCB board corresponding to each via hole 2 is covered with a bottom copper clad layer 3 .

[0026] In this embodiment, a copper clad layer 3 for heat dissipation is added to the bottom layer of the PCB, so that the heat is distributed on the top and bottom layers of the PCB, and the heat dissipation can be effectively accelerated.

specific Embodiment approach 3

[0027] Specific implementation mode three: refer to image 3 This embodiment is described in detail. This embodiment is to further illustrate the PCB board of the power supply circuit for automobile instrument described in the second specific embodiment. In this embodiment, the bottom copper clad layer 3 of the PCB bottom layer and the corresponding top layer copper The area of ​​the layer 1 is close, and the bottom cladding copper layer 3 partially overlaps with the corresponding top copper cladding layer 1 .

[0028] In this embodiment, the areas of the bottom copper clad layer 3 and the top copper clad layer 1 are similar, so that the heat dissipation of the top layer and the bottom layer of the PCB board is similar. The bottom cladding copper layer 3 partially overlaps with the corresponding top copper clad layer 1 , that is, it only overlaps the part of the via hole 2 , and the via hole 2 transfers the heat of the top copper clad layer to the bottom copper clad layer 3 . ...

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Abstract

The invention provides a PCB of a power circuit for an automobile instrument and a design method of the PCB and belongs to the design field of the PCBs of the power circuits for the automobile instruments. The PCB is used for solving the problems of unstable voltage output due to heating of the power circuit for the automobile instrument, and low working efficiency and inconvenience for the production of the production line due to the fixation of a cooling fin, a screw and a nut. The PCB of the power circuit for the automobile instrument is characterized in that the bonding pad of each heating element is covered with a large-area top copper coating. According to the design method of the PCB of the power circuit for the automobile instrument, the large-area top copper coating is designed on the bonding pad of each heating element. The top copper coating is advantageous for quickly dissipating heat and guaranteeing stable voltage output. The PCB and the design method are suitable for the production of the PCBs of the power circuits for the automobile instruments.

Description

technical field [0001] The invention belongs to the design field of the PCB board of the power supply circuit of the automobile instrument, in particular to the design of the heat dissipation PCB board of the high-power power supply circuit. Background technique [0002] The power supply circuit of a 12V automotive instrument generally only uses a SMD power chip to supply power to the entire instrument. With the development of automobile technology, more and more signals need to be indicated by the automotive instrument, and the current carried by the power chip of the automotive instrument is constantly increasing. As the current increases, the heat generated by the heating elements in the power circuit also increases continuously, such as figure 1 Shown is the main heat dissipation device in the 12V automotive instrument power circuit. The heating of the components in the power circuit will cause the voltage output to be unstable. In order to ensure that the circuit can wo...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0209H05K2201/0355
Inventor 邓雷张秀颖赵英张瞵颖
Owner AEROSPACE HI TECH HLDG GROUP
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