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Optical epoxy resin composition and cured product thereof

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, adhesive type, other chemical processes, etc., can solve the problem of insufficient heat discoloration resistance of epoxy resin composition, and achieve high heat resistance and reliability Sexuality, high transparency effect

Active Publication Date: 2018-04-24
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In addition, Patent Document 5 discloses an epoxy resin composition, which is a cured product formed of an epoxy resin and an acid anhydride obtained by reacting a bifunctional epoxy resin, a fluorene ring-containing phenol, and an acid anhydride, and has a high Transparency and good heat resistance reliability, however, the heat discoloration resistance of this epoxy resin composition is insufficient

Method used

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  • Optical epoxy resin composition and cured product thereof
  • Optical epoxy resin composition and cured product thereof
  • Optical epoxy resin composition and cured product thereof

Examples

Experimental program
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Effect test

Embodiment

[0076] Although this invention is demonstrated concretely based on an Example and a comparative example, the scope of this invention is not limited to these Examples. In the following synthesis examples, examples, and comparative examples, "part" means a mass part, and "%" means a mass %. In addition, the following test methods were used in this invention.

[0077] (1) Epoxy equivalent: measured according to JIS K-7236.

[0078] (2) Softening point: measured according to JISK-7234.

[0079] (3) Refractive index: Using an Abbe refractometer (manufactured by ERMA, ER-7MW), dissolve in cyclohexanone so that the solid content reaches 30%, measure at 20° C. and a wavelength of 589.3 nm, and obtain by calculation Out of the solid component 100% refractive index.

[0080] (4) Glass transition temperature (Tg): Measured at a temperature increase rate of 10°C / min from 20°C using a differential scanning calorimeter (manufactured by SII Corporation, EXTERDSC6200).

[0081] (5) Therma...

Synthetic example 1

[0105] 121.5 parts of Rikacid HH as an acid anhydride and 113.6 parts of Rikabinol HB as a dihydric alcohol were added to a reaction device equipped with a stirrer, a thermometer, a nitrogen blowing pipe, and a cooling pipe, and the mixture was stirred in a nitrogen atmosphere while making it Reaction at 130° C. for 2 hours, after obtaining the ester compound containing terminal carboxyl groups, then adding 67.5 parts of Epotohto YD-12856 as epoxy resin, 197.4 parts of BPF as 2 functional phenolic compounds and 0.43 parts of Hishicolin BTPBr as catalyst, in Stirring and mixing were carried out at 150° C. for 4 hours to obtain epoxy resin 1 .

Synthetic example 2

[0107] In the same manner as in Synthesis Example 1, except that 112.9 parts of Rikacid HH was used as an acid anhydride, 105.6 parts of Rikabinol HB as a dihydric alcohol, 27.5 parts of Epotohto YD-12855 as an epoxy resin, 254.0 parts of BPF as a bifunctional phenol compound, and 0.47 parts of HishicolinBTPPBr as a catalyst Operation, to obtain epoxy resin 2.

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Abstract

The present invention provides an epoxy resin composition, an epoxy resin cured product, and a film-like adhesive obtained by using the epoxy resin composition, a protective film for color filters, a sealing material for optical semiconductors, and a substrate for optical semiconductors , Surface protective film for optical semiconductor substrates, the epoxy resin composition can provide a cured product with high transparency and high heat resistance reliability, and is excellent in optical material applications such as LED sealing materials. An epoxy resin composition for optics, which is an epoxy resin composition for optics comprising an epoxy resin (a) and a curing agent (b), wherein the epoxy resin (a) has an epoxy equivalent of 500 to 2000 g / eq, the softening point is 80~150℃, the refractive index (nD20) is 1.55~1.63, the molecular structure has both aromatic ring and aliphatic ring, and the aliphatic proton (A) and aromatic ring in the 1H-NMR spectrum The intensity ratio (B / A) of the group proton (B) is 0.3 to 0.7.

Description

technical field [0001] The present invention relates to a cured epoxy resin for optics that is particularly suitable for use in areas exposed to high temperatures in the use of optical materials and electronic materials. Background technique [0002] Patent Document 1 discloses a method in which a colorant is added to the resin itself, and the printed characters are made clear by the heat applied during laser printing. However, due to the heat applied during laser printing, the The problem of discoloration of epoxy resin, therefore, it is desired to fundamentally prevent discoloration through the improvement of epoxy resin. [0003] In addition, Patent Documents 2 and 3 disclose that by using a specific epoxy resin and a curing agent incorporating a terpene skeleton, heat resistance, adhesiveness, yellowing when heated, etc. can be improved, but the curing agent, epoxy resin, etc. Oxygen resins are all substances that must have a specific skeleton, and curing accelerators a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/24C09J7/30C09J163/00C09K3/10
Inventor 青柳荣次郎和佐野次俊野泽英则军司雅男
Owner NIPPON STEEL CHEM &MATERIAL CO LTD