Multistage sweeping type silicon slice texturing and processing device and control method thereof

Abstract

The invention discloses a multistage sweeping type silicon slice texturing and processing device and a control method thereof. The multistage sweeping type silicon slice texturing and processing device comprises a reaction chamber. A silicon slice moving carrier is arranged in the reaction chamber. At least two plasma downstream sweeping type processing units are arranged on the reaction chamber. A front buffer chamber and a front sluice valve are arranged at an inlet of the reaction chamber. A rear buffer chamber and a rear sluice valve are arranged at an outlet of the reaction chamber. A reaction chamber vacuum suction port is arranged at a position, close to the rear buffer chamber, on the reaction chamber. A constant-temperature radiation block is arranged below the silicon slice moving carrier. The multistage sweeping type silicon slice texturing and the processing device and a control method thereof have the advantages that the multistage sweeping type silicon slice processing units are adopted, independent working gas flow proportion and etching time can be adopted conveniently, and a rapid and efficient silicon slice processing process is achieved; etching speed is increased by the silicon slice moving carrier and the constant-temperature radiation block, so that online continuous processing is achieved, and silicon slice texturing effect is improved.

Description

technical field [0001] The invention relates to a silicon chip processing device and a control method thereof, in particular to a multi-stage purging type silicon chip texture processing device and a control method thereof. Background technique [0002] Silicon solar cell power generation has been considered to be one of the mainstream technologies for future green energy. The market share of silicon solar cells far exceeds that of other types of solar cells, with a market share of more than 90%. With various high-efficiency silicon solar cell processes entering industrial production, the photoelectric conversion efficiency of silicon solar cells has been continuously improved in recent years. High-efficiency polycrystalline silicon solar cells have an efficiency of about 19%, and high-efficiency monocrystalline silicon solar cells have an efficiency of about 21%. [0003] In all high-efficiency silicon solar cell processes, realizing the texture effect with low reflectivit...

AI Technical Summary

Problems solved by technology

However, there are still some problems in the dry etching of silicon wafers, such as: the thick surface lattice damage layer caused by the bombardment of high-energy particles, the slow etching rate of silicon wafers by a single plasma source, and the removal of damaged layers and texturing of silicon wafers cannot be completed at one time , cannot realize the on-line processing of the industrial line, and needs to cooperate with acid and alkali liquid pretreatment and post-treatment, etc., which hinders the industrialization process of dry etching

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