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9results about How to "Avoid causing" patented technology

Preparation method and application of metal corrosion-resistant composite interface layer

The invention discloses a preparation method and application of a metal corrosion-resistant composite interface layer. The problem that an existing electrophoretic coating is insufficient in protection performance is solved. The composite interface layer takes epoxy acrylic cationic resin as a matrix, and contains graphene nanosheets loaded with metal organic framework (MOF) particles and the like; the electrophoresis solution comprises the following components in percentage by mass: 20-30% of resin, 10-20% of talcum powder, 3% of a defoaming agent, 3% of a dispersing agent, 1-10% of GO-MOF and the balance of deionized water. The preparation method comprises the following steps: metal pretreatment, electrophoresis at 60-120V for 0.5-3min, and curing at 160-180 DEG C for 20-30min. GO-MOF enhances the compactness of resin bonding and an interface layer and adsorbs a corrosive medium, Tafel tests show that the corrosion resistance is remarkably improved, and the GO-MOF composite material is suitable for corrosion prevention of a battery pack shell.
Owner:FUJIAN YUANSHENG AUTO PARTS TECH CO LTD

Efficient anti-blocking cement batching and feeding device

ActiveCN224408038UTo achieve the purpose of preventing blockageEnsure the smoothness of fallingScrew jointImpact hammer
The utility model relates to cement production technical field, concretely is efficient anti -blocking cement batching feeding device, including mixing jar, sealing cover and support column, sealing cover and feed hopper outer wall screw joint have bearing seat, the bearing seat inside interference installation has the pivot, the pivot outer wall welds and has the even material board of circular array distribution, the pivot penetrates bearing seat both ends even screw joint has the support column, support column outer wall welds and has the round array distribution of collet, the collet inside is provided with the connecting shaft, the connecting shaft outer wall pin shaft connection has the extension rod, the extension rod end welding has the impact hammer, carry out vibration delivery to material, reduce material and adhere to accumulate at feed hopper or even material board, through reducing the residual amount of material, can improve the feeding accuracy of material, and avoid residual material accumulation caking, the relative cleanness of feed hopper inner wall is guaranteed, thereby realized the purpose of preventing the blockage of feed hopper, and guaranteed the falling smoothness of material.
Owner:HEBEI LONGTENG TECH CO LTD

Integrated large-span assembled delicate steel curtain wall structure

ActiveCN224363495Uavoid causingImprove fire performanceWallsForce measurement
The utility model discloses an integrated large-span assembly type exquisite steel curtain wall structure, concretely relates to the exquisite steel curtain wall structure technical field, including framework component, fixed component, curtain wall component and second connecting component, the side of framework component is equipped with fixed component, and the side away from fixed component of framework component places curtain wall component, and the top of curtain wall component is equipped with second connecting component, and it can carry out real -time detection to the prestress that second fixed bolt exerts to second locating block surface through placing resistance voltage -transforming piece below second connecting component to the value of detection is passed to control panel, and control panel will analyze the prestress that second fixed bolt exerts to second locating block surface, when the prestress is less than certain critical value, and control panel will be in time to the feedback of construction personnel, and lets construction personnel to carry out the rush repair to it.
Owner:XIAMEN MINGZHENG CONSTRUCTION CO LTD

Polishing pad casting mold, polishing pad processing method, and polishing pad

ActiveCN116512144Bavoid causingIncrease expansion ratioMetallurgyMicrosphere
The present application relates to a polishing pad pouring mold, a polishing pad processing method and a polishing pad, wherein the polishing pad pouring mold comprises two pouring pieces, the two sides and the bottom side of each pouring piece are provided with a bonding strip, the bonding strips of the two pouring pieces are connected in opposite directions, so that an inner polishing pad forming groove is formed between the two pouring pieces, the top edge of each pouring piece is provided with a first inclined surface as a pouring point, and the polishing pad processing material can slide along the pouring point to fill the inner polishing pad forming groove; the processing method comprises the following steps: preparing a polishing pad processing material; heating the polishing pad pouring mold to 50-70 DEG C; pouring the polishing pad processing material into the inner polishing pad forming groove of the polishing pad pouring mold; and vulcanizing the polishing pad processing material in the polishing pad pouring mold to form a solid. Compared with the prior art, the present application can improve the density and the uniformity of the microsphere expansion ratio of the formed polyurethane cake body, and effectively improve the yield.
Owner:SHANGHAI XINQIAN INTEGRATED CIRCUIT CO LTD

Wire bonding apparatus for chip packaging

ActiveCN224419273Uavoid causingStructural engineeringVisual positioning
The application relates to a wire bonding device for chip packaging, which comprises a machine table, a dust cover and a wire bonding mechanism arranged on the machine table, the dust cover is connected with the machine table to form a containing cavity, and the wire bonding mechanism is located in the containing cavity; a visual positioning assembly is arranged on the machine table, and the dust cover is a transparent cover which enables the visual positioning assembly to obtain images at the wire bonding mechanism. According to the application, the wire bonding mechanism is located in the containing cavity surrounded by the dust cover and the machine table, so that the chip in the wire bonding is located in the containing cavity and is isolated from the environment of the machine table, thereby avoiding that particles are adhered to the surface of the chip and causing defective products.
Owner:SHANGHAI INTEGRATED CIRCUIT RESEARCH & DEVELOPMENT CENTER CO LTD