Manufacturing method of sapphire lens substrate

A production method, sapphire technology, applied in the direction of manufacturing tools, stone processing equipment, fine working devices, etc., can solve the problems of low efficiency and low yield of processing methods, and achieve simple and beautiful appearance, high yield and cost saving Effect

Active Publication Date: 2015-07-08
LENS TECH
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a sapphire lens substrate with a simple process to solve the technical problems of low efficiency and low yield in existing processing methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of sapphire lens substrate
  • Manufacturing method of sapphire lens substrate
  • Manufacturing method of sapphire lens substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] 1. After the orientation of the crystal ball is completed, the crystal ball is processed into a cylindrical ingot with a diamond barrel cutter, and the crystal direction of the ingot is selected as C direction;

[0045] The inner diameter of the barrel cutter used is 59mm, the outer diameter is 65mm, the diamond grit is 80um, and the spindle speed is 300rpm;

[0046] 2. Use a diamond wire saw to cut the cylindrical ingot into discs with a thickness of 0.3mm and a diameter of 55mm;

[0047] 3. Surface treatment of circular wafers by grinding and polishing to meet the requirement of roughness Ra≤5nm;

[0048] 4. Use laser cutting to cut the sapphire wafer into a conical camera substrate. The diameter of the camera substrate is 5mm and the thickness is 0.3mm; the laser cutting removal amount of the wafer is 5um, and the cutting speed is 10mm / s.

[0049] The utilization rate of raw materials is 96.1%. It takes 109.96s to cut a wafer, and 70PCS of camera substrates are cut ...

Embodiment 2

[0051] 1. After the orientation of the crystal ball is completed, the crystal ball is processed into a cylindrical ingot with a diamond barrel cutter, and the crystal direction of the ingot is selected as C direction;

[0052] The inner diameter of the barrel cutter used is 51mm, the outer diameter is 58mm, the diamond grit is 70um, and the spindle speed is 280rpm;

[0053] 2. Use a diamond wire saw to cut the cylindrical ingot into discs with a thickness of 0.7mm and a diameter of 48mm;

[0054] 3. Surface treatment of circular wafers by grinding and polishing to meet the requirement of roughness Ra≤5nm;

[0055] 4. Use laser cutting to cut the sapphire wafer into a cylindrical camera substrate. The diameter of the camera substrate is 7mm and the thickness is 0.7mm; the laser cutting removal volume of the wafer is 3um, and the cutting speed is 8mm / s.

[0056] The utilization rate of raw materials is 97.2%. It takes 65.98s to cut a wafer, and 24PCS of camera substrates are cu...

Embodiment 3

[0058] 1. After the orientation of the crystal ball is completed, the crystal ball is processed into a cylindrical ingot with a diamond barrel cutter, and the crystal direction of the ingot is selected as C direction;

[0059] The inner diameter of the barrel cutter used is 55mm, the outer diameter is 62mm, the diamond grit is 75um, and the spindle speed is 290rpm;

[0060] 2. Use a diamond wire saw to cut the cylindrical ingot into discs with a thickness of 0.5mm and a diameter of 52mm;

[0061] 3. Surface treatment of circular wafers by grinding and polishing to meet the requirement of roughness Ra≤5nm;

[0062] 4. Use laser cutting to cut the sapphire wafer into a frustum-shaped camera substrate. The diameter of the camera substrate is 7mm and the thickness is 0.5mm; the laser cutting removal volume of the wafer is 4um, and the cutting speed is 9mm / s.

[0063] The utilization rate of raw materials is 95.7%. It takes 73.3s to cut a wafer, and 30PCS of camera substrates are cu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to view more

Abstract

The invention provides a manufacturing method of a sapphire lens substrate. The method comprises the steps of processing a directional crystal ball into a cylindrical crystal bar through a diamond cylindrical knife; cutting the cylindrical crystal bar into circular sheets through a diamond wire saw, wherein the circular sheets are 0.3 to 0.7mm in thickness and 48 to 55mm in diameter; performing boundary dimension fine processing for the sapphire circular sheets or cylinders through a CNC stand; cutting the sapphire circular sheets into circular camera substrates by the laser cutting manner, wherein the camera substrates are 5 to 7mm in diameter and 0.3 to 0.7mm in thickness; or cutting the sapphire cylinder into the circular camera substrates by the laser cutting manner. With the adoption of the method, the working efficiency and the product yield can be increased.

Description

technical field [0001] The invention relates to the field of camera manufacturing, in particular to a method for manufacturing a sapphire camera lens. Background technique [0002] The camera head includes a window lens and a metal ring for installing the window lens, etc. At present, the camera window lens generally uses transparent glass as a raw material, or adds a coating on its surface to increase its wear resistance. Therefore, the existing panels generally have low hardness, are not wear-resistant, and are easy to scratch, resulting in scratches on the window lens, which seriously affects the appearance, light transmittance, and user experience in taking pictures and photography. [0003] Due to its high hardness, high light transmittance, and good physical, chemical and optical properties, sapphire material has a good prospect for application in camera lenses. However, the camera substrate is small in size, thin in thickness, and round in shape. Traditional sapphir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04B23K26/38
CPCB23K26/38B28D5/0005B28D5/045
Inventor 周群飞饶桥兵胡波卫
Owner LENS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap