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Epoxy resin mixture, epoxy resin composition and cured product thereof

A technology of epoxy resin and mixture, applied in the field of epoxy resin composition and its cured product, can solve problems such as the adverse effect of metal wires, and achieve the effect of excellent flame retardancy

Active Publication Date: 2018-06-12
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it has a bad influence on the connection part of the metal wire

Method used

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  • Epoxy resin mixture, epoxy resin composition and cured product thereof
  • Epoxy resin mixture, epoxy resin composition and cured product thereof
  • Epoxy resin mixture, epoxy resin composition and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] 214.7 parts of binaphthol, 46.6 parts of 4,4'-biphenol, 740 parts of epichlorohydrin, and 296 parts of dimethyl sulfoxide were added to a flask equipped with a stirrer, a reflux cooling pipe, and a stirring device while purging nitrogen. , dissolved under stirring, and heated to 45°C. Next, after adding 84 parts of flake-shaped sodium hydroxide in batches over 90 minutes, reaction was performed at 45° C. for 2 hours, and reaction was performed at 70° C. for 75 minutes. After completion of the reaction, solvents such as excess epichlorohydrin were distilled off from the oil layer under reduced pressure using a rotary evaporator. After adding 800 parts of methyl isobutyl ketone to the residue and washing with water, the temperature was raised to 75°C. Add 30 parts of a 30% by weight aqueous sodium hydroxide solution with stirring, react for 1 hour, then wash with water until the washing water of the oil layer becomes neutral, and distill off the methyl isophthalic acid f...

Synthetic example 1

[0132] In the flask equipped with stirrer, reflux cooling pipe, stirring device, add 214 parts of binaphthols, 555 parts of epichlorohydrins (4 molar equivalents with respect to phenolic resin), 55 parts of methyl alcohol while implementing nitrogen purging, stir Dissolve under temperature and raise the temperature to 70-75°C. Next, after adding 60 parts of flaked sodium hydroxide in portions over 90 minutes, reaction was performed at 75° C. for 75 minutes. After completion of the reaction, water was washed with 400 parts of water, and solvents such as excess epichlorohydrin were distilled off from the oil layer under reduced pressure using a rotary evaporator. To the residue, 500 parts of methyl isobutyl ketone was added and dissolved, and the temperature was raised to 75°C. Add 10 parts of 30% by weight sodium hydroxide aqueous solution and 10 parts of methanol under stirring, react for 1 hour, then wash with water until the washing water of the oil layer becomes neutral, a...

Synthetic example 2

[0134] Change 214.7 parts of binaphthol and 46.6 parts of 4,4'-biphenol into 242 parts of 3,3',5,5'-tetramethylbiphenyl-4,4'-diol, except that it is the same as the example 1 was synthesized in the same manner. As a result, 349 parts of epoxy resins (EP3) were obtained. The obtained epoxy resin had an epoxy equivalent of 190 g / equivalent, a softening point of 107° C., and an ICI melt viscosity at 150° C. of 0.03 Pa·s or less.

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Abstract

The objective of the present invention is to provide: an epoxy resin mixture having superior fluidity and that provides a cured product having superior heat resistance and flame resistance; and an epoxy resin composition. The epoxy resin mixture contains 1,1'-bis(2-glycidyloxynaphthyl) and substituted (or unsubstituted) 4,4'-bis glycidyloxybiphenyl (where when the substituent group has an aromatic ring thereof, there are no more than four substituent groups and no more than four carbon atoms).

Description

technical field [0001] The present invention relates to an epoxy resin mixture capable of providing a composition having excellent fluidity and a cured product having excellent flame retardancy and heat resistance. [0002] In addition, the present invention relates to an epoxy resin mixture, an epoxy resin composition, and a cured product thereof suitable for use in electrical and electronic materials requiring high functionality, especially as a sealant for semiconductors and a film substrate material. Background technique [0003] Epoxy resin compositions are widely used in electrical and electronic components, structural materials, adhesives, coatings, etc. due to their workability and excellent electrical properties, heat resistance, adhesiveness, and moisture resistance (water resistance) of their cured products. field. [0004] However, in recent years, in the electrical and electronic field, along with the development of this field, it is required to further improve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/24
CPCC08G59/24C08G59/245C08L63/00C08L2205/02
Inventor 中西政隆江原清二井上一真
Owner NIPPON KAYAKU CO LTD