Etching fluid, replenishing fluid, and method for forming copper wiring

Abstract

Provided are an etching fluid that is capable of suppressing side etching while not impairing the linearity of copper wiring, a replenishing fluid for the same, and a method for forming copper wiring. This etching fluid is a copper etching fluid characterized in being an aqueous solution containing acid, oxidizing metal ions, and a compound (A), the compound (A) having in molecules thereof an amino group and at least one sulfur-containing functional group selected from the group consisting of thiole groups, sulfide groups, and disulfide groups (where the sulfide and disulfide groups are groups in which the sulfur atoms and the heteroatoms linked thereto are linked by a single bond, and which do not form π conjugates).

Description

technical field [0001] The present invention relates to a copper etching solution, its supply solution, and a method for forming copper wiring. Background technique [0002] In the manufacture of a printed wiring board, when forming a copper wiring pattern by photolithography, ferric chloride-based etchant, copper chloride-based etchant, alkaline etchant, etc. are used as etchant. When these etching solutions are used, copper under the etching resist may dissolve from the side surface of the wiring pattern, which may be called "side etching". That is, the following phenomenon occurs: the part (that is, the copper wiring part) that is covered by the etching resist and is not expected to be removed by etching is removed by the etching solution, and the width of the copper wiring changes from the bottom to the top. thin. Especially in the case of a fine copper wiring pattern, it is necessary to reduce such side etching as little as possible. In order to suppress this undercu...

AI Technical Summary

Problems solved by technology

That is, the following phenomenon occurs: the part (that is, the copper wiring part) that is covered by the etching resist and is not expect

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