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Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution

A management method and technology of etching solution, which is applied in the field of etching solution, can solve problems such as difficulties and impracticalities, and achieve the effects of suppressing side erosion and small changes in etching speed

Inactive Publication Date: 2014-05-07
MITSUBISHI PAPER MILLS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the technology of Patent Document 9, all the fluctuation data of various causes of fluctuation are required, and when the composition of the etchant changes with time due to the processing of copper foil, it is difficult to prepare all the data in advance, and it is not practical.

Method used

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  • Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution
  • Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution
  • Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0068] [Preparation of etching solution]

[0069] In 270 grams (100 grams in the form of anhydrous) commercially available 40o Bomei ferric (III) chloride aqueous solution (concentration 37% by mass), 25 grams (20 grams in the form of anhydrous) copper chloride (II) ) dihydrate, 14 g (10 g in anhydrous form) oxalic acid dihydrate, add 1 kg of water to prepare 10 mass % iron (III) chloride, 2 mass % copper chloride, 1 Mass % oxalic acid etchant.

[0070] [Etching and Regeneration]

[0071] On a glass epoxy substrate with a rolled copper foil with a thickness of 9 μm on the surface, the lines were formed using a positive photoresist (w 3 ) / gap widths are each 25 μm / 25 μm of the resist pattern. The etching was performed by spraying the above-mentioned etching solution adjusted to 20° C. toward the above-mentioned substrate under the conditions of a liquid supply pressure to the nozzle of 150 kPa and an injection volume of 1320 mL / min using a full-cone nozzle with a diameter of...

Embodiment 2～9、 comparative example 1～13）

[0075] In the same manner as in Example 1, etching solutions containing the respective composition concentrations shown in Tables 1 to 3 were prepared, and on the substrate on which the same resist pattern as in Example 1 had been formed, the same regeneration and etching treatment were performed, and the same Evaluation.

[0076] [Table 1]

[0077]

[0078] [Table 2]

[0079]

[0080] [table 3]

[0081]

[0082] As can be seen from Table 1, the etching solution of the present invention has less side etching and less change in etching rate even when regeneration is performed. In particular, it was found that an etching solution using oxalic acid as a compound that forms an insoluble salt with copper is an etching solution with very few side etchings.

[0083] On the other hand, as in Comparative Examples 1, 2, and 7, in the etching solution to which the compound that forms an insoluble salt with copper was not added, almost no suppression of side etching was observ...

Embodiment 10）

[0086] [Preparation of etching solution]

[0087] In 216 grams (100 grams in the form of anhydrous) commercially available 40o Bomei ferric (III) chloride aqueous solution (concentration 37% by mass), 25 grams (20 grams in the form of anhydrous) copper (II) chloride ) dihydrate, 7 grams (5 grams in the form of anhydrous) oxalic acid dihydrate, add 1 kg of water to prepare iron (III) chloride containing 8 mass %, 2 mass % copper chloride, 0.5 mass % oxalic acid etching solution.

[0088] [etching]

[0089] On a glass epoxy resin substrate with a rolled copper foil with a thickness of 9 μm on the surface, a full cone nozzle with a diameter of 20 cm of the spray surface was used, and the liquid supply pressure to the nozzle was 150 kPa and the spray rate was 1000 mL / min. The etching was performed by spraying the above-mentioned etching solution adjusted to 30°C toward the above-mentioned base material.

[0090] [Numerical measurement for regeneration management]

[0091] The ...

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Abstract

Disclosed is an etching solution for copper or a copper alloy, which is mainly composed of water and contains (1) 5 to 20 mass% of iron chloride (III), (2) 0.5 to 3 mass% of copper chloride (II), and (3) a compound capable of, together with copper, forming an insoluble salt in an amount of 5 to 20 mass% relative to the amount of iron chloride (III).  Also disclosed is an etching method using the etching solution as a new solution.  Further disclosed is a method for managing the reproduction of an etching solution, in which the management of reproduction is carried out by employing the ratio of permeability among two or more different wavelengths.

Description

technical field [0001] The present invention relates to an etching solution for copper or a copper alloy, an etching method, and a regeneration management method of the etching solution. Background technique [0002] In recent years, miniaturization and high performance of electronic devices have rapidly progressed, and printed wiring boards incorporated in these devices are also strongly required to have high circuit density. [0003] As a method of manufacturing printed wiring boards, a subtractive method is widely used in which a resist pattern is formed on a substrate with copper foil adhered in advance, and an etching solution such as an aqueous solution of iron (III) chloride is used to remove unnecessary copper foil. However, when a printed wiring board is produced by this method, it is known that so-called undercutting occurs, that is, the etchant spreads to the back of the resist pattern, making the line width wider than that of the resist pattern. Thin, or the sha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18C23F1/46G01N21/27
CPCC23F1/46H05K3/067C23F1/18
Inventor 山根宪吾加藤真石田麻里子
Owner MITSUBISHI PAPER MILLS LTD
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