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One-component epoxy adhesive used for bonding LED backlight modules LENS

A technology of epoxy adhesive and backlight module, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problem of insufficient moisture and heat aging resistance of single-component epoxy, and achieve the effect of excellent moisture and heat aging performance

Inactive Publication Date: 2015-07-15
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the problem of insufficient moisture and heat aging resistance of the existing low-temperature rapid curing single-component epoxy resin, through optimization and screening of epoxy resin, mercapto ester resin, and toughening agent, especially the addition of moisture and heat aging resistance with carbodiimide structure agent to achieve the purpose of heat and humidity resistance

Method used

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  • One-component epoxy adhesive used for bonding LED backlight modules LENS
  • One-component epoxy adhesive used for bonding LED backlight modules LENS
  • One-component epoxy adhesive used for bonding LED backlight modules LENS

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Preparation:

[0019]

[0020] Preparation:

[0021] Accurately weigh various raw materials according to the proportion of the formula. acid) ester, γ-mercaptopropyltriethoxysilane, N, N'-diisopropylcarbodiimide, mix evenly, then add calcium sulfate (add in three times) mix evenly, and then add fumed silica , titanium dioxide, isopropyl isocyanate, and PN-23 are mixed evenly (control temperature is 20-35 degrees), and the material is discharged after 30 minutes of full vacuum.

Embodiment 2

[0023]

[0024] Preparation:

[0025] Accurately weigh various raw materials according to the proportion of the formula. ) ester, 3 glycidyl ether oxypropyl trimethoxysilane, dicyclohexyl carbodiimide and mix evenly, then add calcium carbonate (add in three times) mix evenly, then add fumed silica, isocyanate benzene Ester and PN-H are mixed evenly (control temperature is 20-35 degrees), and the material is discharged after 30 minutes of full vacuum.

Embodiment 3

[0027]

[0028] Preparation:

[0029] Accurately weigh various raw materials according to the proportion of the formula. Glyceryl ether oxypropyl trimethoxysilane, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride are mixed evenly, then calcium carbonate is added (adding in three times) and mixed evenly, then Add gas-phase silica, benzyl isocyanate, and PN-H in sequence and mix well (control the temperature at 20-35 degrees), and discharge the material after full vacuum for 30 minutes.

[0030] Table 1 is the performance test result after curing of the listed embodiment and the comparative example of similar products on the market, and the test result shows:

[0031] The invention has excellent anti-aging performance and can meet the needs of LED backlight module LENS bonding.

[0032] Table 1

[0033]

[0034] Note: The shear strength is tested according to the standard of GB / T7124-1986.

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Abstract

The present invention relates to the technical field of adhesives, and relates to a one-component epoxy adhesive used for bonding LED backlight modules LENS, and a preparation method thereof. The one-component epoxy adhesive comprises the following components by weight: 30-40 parts of epoxy resin; 10-15 parts of an epoxy flexibilizer; 34-40 parts of polymercaptan; 20-30 parts of a filler; 5-7 parts of a promoter; 1-2 parts of a stabilizer; 0.5-1 part of a coupling agent and 1-2 parts of a water absorbent. Compared with the previous invention, the one-component epoxy adhesive has excellent heat and humidity aging resistance while maintaining low temperature curing performance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a one-component epoxy adhesive used for bonding LENS in the manufacturing process of LED backlight modules and a preparation method thereof. technical background [0002] In recent years, the liquid crystal display industry has developed rapidly, and the backlight (BackLight) as a liquid crystal display ( LCD ) behind a light source, its luminous effect will directly affect the liquid crystal display module ( LCM )Visual effects. In the process of producing backlight, a low-temperature and fast-curing adhesive is needed to bond PMMA LENS to the PCB. In recent years, the amount of glue used for this glue point has increased rapidly, and This glue point generally uses imidazole or amine adducts as accelerators for the curing system of epoxy resin and mercapto ester compounds such as patent: CN1934158A, but because imidazole or amine adducts are easier to absorb wat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
Inventor 宋彦鹏王晓颖史伟同李守平
Owner TONSAN ADHESIVES INC
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