Thermosetting resin composition, cured product, composition for optical semiconductor, and optical semiconductor element

Abstract

An object of the present invention is to provide a thermosetting resin composition, a cured product, a composition for an optical semiconductor, and an optical semiconductor element which are excellent in reliability as a sealing compound for LEDs, which have heat resistance, UV resistance, and High refractive index, high adhesion, improved moisture reflow resistance and thermal cycle resistance, and further improved sulfur resistance, containing: (A) a thermosetting resin containing a SiH group and an alkenyl group, which is a SiH A reaction product of a silsesquioxane having two alkenyl groups and an organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having a SiH group, which is obtained by making a silsesquioxane having a SiH group, having Obtained by reacting an organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group, and a silyl compound having an alkenyl group; (C) Linear organopolysiloxane having a SiH group only at one end compound; and (D) a Pt catalyst.

Description

technical field [0001] The present invention provides a thermosetting resin composition, a cured product obtained by curing the thermosetting resin composition, a composition for an optical semiconductor containing the thermosetting resin composition, and an optical semiconductor composition containing the composition for an optical semiconductor. In the optical semiconductor element, the thermosetting resin composition has both heat resistance and a high refractive index, and contains a thermosetting resin containing a silsesquioxane and an organopolysiloxane. Background technique [0002] White light emitting diodes (Light Emitting Diodes, LEDs) are used for lighting and the like, but with increasing output, heat generation of LED packages becomes a problem. In addition, when an epoxy resin is used for a sealing material, yellowing due to heat generation cannot be avoided, so a silicone resin is used for a white LED sealing material instead of an epoxy resin. Silicone res...

AI Technical Summary

Problems solved by technology

[0006] In the above-mentioned high-temperature region, the commonly used phenyl silicone resin not only has strong brightness deterioration due to yellowing, but also cracks due to resin deterioration.

Dimethicone resin has little deterioration in brightness due to yellowing, but in the above-mentioned high-temperature range, the resin further deteriorates, cracks occur, and brightness deteriorates, which may not be applicable to the above-mentioned high-power LED applications.

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