Solder powder doped with tin-plated alloy powder and solder paste containing same

A technology of alloy powder and solder powder, which is applied in the field of processing of welding and surface treatment materials for electronic device assembly, which can solve the problems of high price and achieve the effects of reducing the cost of solder paste, consistent appearance and excellent soldering effect

Active Publication Date: 2017-04-26
昆山成利焊锡制造有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, tin alloy powders for domestic solder paste mainly include tin-bismuth powder alloys, tin-silver-copper powder alloys, tin-lead powder alloys and other tin-based metal powder alloys. The prices of these alloys are relatively expensive.

Method used

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  • Solder powder doped with tin-plated alloy powder and solder paste containing same
  • Solder powder doped with tin-plated alloy powder and solder paste containing same
  • Solder powder doped with tin-plated alloy powder and solder paste containing same

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with specific embodiments of the present application.

[0018] The solder powder doped with tin-plated alloy powder in the present invention is composed of tin-plated alloy powder and the rest of tin alloy powder, wherein the tin-plated alloy powder is obtained by heating the surface of non-tin alloy powder with a particle diameter of 20-45 μm. Prepared by electroless tin plating, the non-tin alloy powder is at least one of metal copper powder, plastic copper plating powder, ceramic copper plating powder and silicon oxide copper plating powder, and the tin alloy powder is tin-copper alloy, tin-silver-copper At least one of alloys and tin-bismuth alloys. The non-tin alloy powders adopted in this embodiment are all finished products purchased on the market such as metal copper powder, plastic copper-plated powder, ceramic copper-plated powder and silicon oxide copper-plated powder; For example, tin-co...

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Abstract

The invention discloses solder powder doped with tin-plated alloyed powder and soldering paste containing the solder powder. The tin-plated alloy powder is obtained by plating surfaces of metal copper powder, plastic copper-plated powder, ceramic copper-plated powder and silicon oxide copper-plated powder with tin, the tin-plated alloyed powder is mixed with tin alloy powder frequently seen and sold on the present market to form the solder powder to be used in the soldering paste, the wettability between the tin-plated alloyed powder and the tin alloy powder is high, the bonding force is large, the appearance is constant after welding, it is avoided that small tin balls appear on welded points obtained after welding or left outside a welding disc, the tin soldering effect of the soldering paste containing the solder powder is superior to that of tin soldering powder sold on the market, the soldering paste can be used for assembling of PCB electronic components and the reflow soldering process of other metal elements, and the cost of the soldering paste can be greatly reduced.

Description

technical field [0001] The invention relates to a solder powder, in particular to a solder powder doped with tin-plated alloy powder and a solder paste containing the solder powder, belonging to the field of processing of welding and surface treatment materials for electronic device assembly. Background technique [0002] With the development of society and the development and utilization of mineral resources, in 2008-2009, the State Council continuously announced all 44 cities with exhausted resources in the country, among which many old cities in Yunnan Province, which are famous for their tin production, were listed. And in the past ten years, the price of tin has fluctuated frequently, with the highest rising to more than 200,000 a ton, and the lowest falling to more than 80,000 a ton. Under the circumstances of such price fluctuations and the depletion of mineral resources, it is very difficult for enterprises that produce tin products to It is difficult to grasp the ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363C23C18/52B23K101/42
CPCB23K35/262B23K35/362B23K2101/42C23C18/52
Inventor 苏传猛晏和刚谢明贵苏传港苏燕旋何繁丽
Owner 昆山成利焊锡制造有限公司
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