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Polyimide resin composition

A technology of polyimide resin and composition, which is applied in the field of polyimide resin composition, can solve problems such as high thermal expansion coefficient and poor heat resistance, and achieve improved heat resistance, lower use temperature, and lower expansion The effect of the coefficient

Inactive Publication Date: 2015-07-22
广西藤县通轩立信化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing polyimide resin products have the disadvantages of high thermal expansion coefficient, poor heat resistance, and need to be processed at high temperature.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] This polyimide resin composition is made up of following components:

[0016] 1000g of polyimide resin, 50g of epoxy resin fiber, 60g of phenolic resin fiber, 150g of bismaleimide and 200g of light calcium carbonate.

[0017] The preparation method is as follows: the above-mentioned components are stirred evenly.

[0018] Compared with existing polyimide resin products, the polyimide resin composition of this embodiment has better expansion coefficient and heat resistance, and does not need to be processed at high temperature.

Embodiment 2

[0020] This polyimide resin composition is made up of following components:

[0021] 1000g of polyimide resin, 80g of epoxy resin fiber, 100g of phenolic resin fiber, 80g of bismaleimide and 100g of light calcium carbonate.

[0022] The preparation method is as follows: the above-mentioned components are stirred evenly.

[0023] Compared with existing polyimide resin products, the polyimide resin composition of this embodiment has better expansion coefficient and heat resistance, and does not need to be processed at high temperature.

Embodiment 3

[0025] This polyimide resin composition is made up of following components:

[0026] 1000g of polyimide resin, 70g of epoxy resin fiber, 120g of phenolic resin fiber, 120g of bismaleimide and 300g of light calcium carbonate.

[0027] The preparation method is as follows: the above-mentioned components are stirred evenly.

[0028] Compared with existing polyimide resin products, the polyimide resin composition of this embodiment has better expansion coefficient and heat resistance, and does not need to be processed at high temperature.

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Abstract

The invention discloses a polyimide resin composition, and belongs to the technical field of high polymer materials. The polyimide resin composition is prepared from the following constituents in parts by weight: 100 parts of polyamide resin, 5 to 8 parts of epoxy resin fiber, 6 to 12 parts of phenolic resin fiber, 8 to 15 parts of bismaleimide, and 10 to 30 parts of light calcium carbonate. The polyimide resin composition adds the epoxy resin fiber, the phenolic resin fiber and the bismaleimide on the original basis of the polyimide resin, thereby effectively reducing the expansion coefficient, improving the heat resistance and reducing the operating temperature.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, in particular to a polyimide resin composition. Background technique [0002] Polyimide resin is an engineering plastic with high modulus, high strength, low water absorption, hydrolysis resistance, radiation resistance, excellent insulation and thermal oxidation resistance. It is used in aerospace, electrical insulation, atomic energy industry, satellites, nuclear submarines And microelectronics and other precision machinery have a wide range of applications. [0003] Most of the existing polyimide resin products have the disadvantages of high coefficient of thermal expansion, poor heat resistance, and need to be processed at high temperature. Contents of the invention [0004] The invention provides a polyimide resin composition, which has a low thermal expansion coefficient and good heat resistance, and does not need to be processed at high temperature. [0005] In order to solve...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L63/00C08L61/06C08K5/3415C08K3/26
CPCC08L79/08C08L2201/08C08L2205/03C08L2205/16C08L63/00C08L61/06C08K5/3415C08K2003/265
Inventor 关炽昌刘涛
Owner 广西藤县通轩立信化学有限公司
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