A kind of magnetic sensor device and its preparation technology
A preparation process and magnetic sensing technology, applied in the manufacture/processing of electromagnetic devices, measuring devices, measuring magnetic variables, etc., can solve the problems of long preparation cycle, long process flow and high preparation cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0104] The invention discloses a magnetic sensing device, which includes a peripheral circuit and a magnetic sensing component, wherein one or more metal layers are used not only to realize the function of the peripheral circuit, but also to realize the magnetic The function of the sensing part. The peripheral circuit includes a multi-layer metal layer; one or more metal layers in the peripheral circuit are used to realize the self-detection or / and SET / RESET or / and electrical connection function of the magnetic sensing device, or As an electrode metal for magnetic sensing devices.
[0105] In this embodiment, the magnetic sensing device is a two-axis magnetic sensing device; the magnetic sensing device includes multiple layers of metal layers, magnetic material layers, and electrode layers. One or more layers of the multi-layer metal layer belong to a part of the peripheral circuit, and realize the self-detection or / and SET / RESET or / and electrical connection function of the m...
Embodiment 2
[0122] The difference between this embodiment and Embodiment 1 is that in this embodiment, the magnetic sensing device is a three-axis magnetic sensing device; the three-axis magnetic sensing device includes a horizontal direction magnetic sensor (for its structure, please refer to the embodiment The description of one will not be repeated here), vertical magnetic sensor.
[0123] see Figure 26 , the vertical direction magnetic sensor includes a substrate containing a peripheral circuit, the peripheral circuit is arranged on one side of the substrate 201, including a first metal layer 203, a second metal layer 204, a first metal layer 203, a second metal layer 204 separated by the first insulating dielectric layer 202 of the substrate 201 .
[0124] A second insulating medium layer 205 is laid on the first insulating medium layer 202, and a groove 206 is formed on the surface of the second insulating medium layer 205; the vertical direction magnetic sensor further includes a...
Embodiment 3
[0142] The difference between this embodiment and Embodiment 1 is that the two metal layers of the ASIC circuit are used as the self-detection of the magnetic sensor and the metal layer of SET / RESET respectively, which can reduce the metal layers of the two-layer magnetic sensor manufacturing, that is, only need to add one The metal of the first layer can realize the function of the chip.
[0143] see Figure 27 , in this embodiment, the magnetic sensing device is a two-axis magnetic sensing device; the peripheral circuit is arranged on one side of the substrate, including a first metal layer, a second metal layer, a first metal layer, a second metal layer The layers are separated by a first insulating dielectric layer of the substrate.
[0144] A second insulating medium layer is laid on the first insulating medium layer, and a magnetic material layer is arranged on the second insulating medium layer; the magnetic material layer includes two columns of magnetic material unit...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


