A multi-electrode laminated electrohydrodynamic micropump
A chip-laminated, electro-fluid technology, applied in electrical components, electromechanical devices, etc., can solve the problems of poor heat dissipation and low power effect, and achieve the effect of no maintenance, easy production, and broad application prospects.
Inactive Publication Date: 2017-08-29
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
It solves the technical problem that the power effect of the electrohydrodynamic pump in the prior art is low, resulting in poor cooling effect
Method used
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[0030] like Figures 1 to 5 shown. A multi-electrode sheet stacked electrohydrodynamic micro-pump according to the present invention comprises: an upper cover plate 2, an upper layer of silica gel membrane 3, an upper layer of electrode sheet 4, a middle layer of silica gel membrane 5, The middle electrode sheet 6, the lower silica gel film 7 and the lower electrode sheet 8;
[0031] The upper surface of the upper electrode sheet 4, the middle electrode sheet 6 and the lower electrode sheet 8 are all composed of upwardly protruding collector electrodes and emitter electrodes. Electrode array; the ends of the collector and the emitter are respectively led out of the comb-shaped electrode array by wires;
[0032] One end of the upper electrode sheet 4, the lower electrode sheet 8 and the middle electrode sheet 6 is provided with a liquid through hole 8-1 (diameter 3mm, the projection distance of the through hole is 15mm in the top view plane); The opening position of the liqu...
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The invention discloses a multi-electrode-plate laminating type electrofluid dynamic micro-pump. The multi-electrode-plate laminating type electrofluid dynamic micro-pump comprises an upper cover plate, an upper silicone membrane, a middle silicone membrane, a lower silicone membrane, an upper electrode plate, a middle electrode plate and a lower electrode plate, wherein the upper cover plate, the silicone membranes and the electrode plates are arranged in sequence from top to bottom. A comb-tooth-shaped electrode array is formed by collector electrodes and emitting electrodes on the upper, middle and lower electrode plates. Rounded rectangular troughs are machined in the middle portions of the three silicone membranes, and after the components are assembled, S-shaped micro-pump cavities are formed by the troughs and through holes in the three electrode plates. When the multi-electrode-plate laminating type electrofluid dynamic micro-pump is used, a liquid inflow pipe and a liquid outflow pipe are connected with an external circulating system, the whole cavities are filled with liquid, then the micro-pump is connected with a 500V direct-current power source, and the liquid is driven to flow through the electrofluid dynamic effect. According to the multi-electrode-plate laminating type electrofluid dynamic micro-pump, a multi-electrode-plate laminating type structure is adopted, the cavities on three layers are connected through the through holes, and a serial liquid channel is formed. Electric fields are generated by the three electrode plates at the same time, the effect of dragging ions is enhanced, and the dynamic effect of the electrofluid dynamic micro-pump is substantially improved.
Description
technical field [0001] The invention relates to the field of microelectronic heat dissipation and microfluidic control, in particular to a multi-pole lamination type electrohydrodynamic micropump. Background technique [0002] In the field of microelectronic heat dissipation, as the integration of electronic components becomes higher and higher, the power density of electronic chips continues to increase, and their heat flux density also begins to increase significantly. The temperature of the chip greatly affects the life of the chip. In order to ensure that the chip can work in a suitable temperature range, a good heat dissipation solution must be used to discharge the heat generated by it in time. [0003] The forced convection of the working fluid in the microchannel heat sink will significantly improve the heat dissipation effect; and through the study of the heat source of the chip, it is found that the heat lost from the upper part of the chip accounts for about 20% o...
Claims
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IPC IPC(8): H02K44/02
Inventor 柳俊城陈伯扦万珍平邵浩然马明怡谢松汝
Owner SOUTH CHINA UNIV OF TECH