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Method for manufacturing semiconductor device

A manufacturing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as not being well solved, and achieve the effect of reducing the difficulty of the process

Active Publication Date: 2015-07-29
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the prior art, how to embed the manufacturing process of the MRAM device into the standard CMOS process has not been well resolved

Method used

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  • Method for manufacturing semiconductor device
  • Method for manufacturing semiconductor device
  • Method for manufacturing semiconductor device

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Embodiment Construction

[0035] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0036] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0037] It will be understood that when an element or layer is referred t...

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Abstract

The invention provides a method for manufacturing a semiconductor device, and relates to the technical field of semiconductors. According to the method for manufacturing the semiconductor device, the manufacturing process of an MRAM (magnetic random access memory) is embedded into the process of a standard CMOS (complementary metal oxide semiconductor), thereby being capable of reducing the process difficulty, being capable of improving the performance of a magnetic tunnel junction, and thus improving the performance of the whole semiconductor device.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a semiconductor device. Background technique [0002] In the field of semiconductor technology, magnetoresistive random access memory MRAM (Magnetic Random Access Memory) has attracted more and more attention from the industry due to its low power consumption and non-volatile characteristics. [0003] However, in the prior art, how to embed the manufacturing process of the MRAM device into the standard CMOS process has not been well resolved. [0004] Therefore, the present invention proposes a method for manufacturing a semiconductor device, which embeds the manufacture of a magnetoresistive random access memory (MRAM) into a standard CMOS process. Contents of the invention [0005] Aiming at the deficiencies of the prior art, the present invention proposes a manufacturing method of a semiconductor device, which embeds the manufacturing of MR...

Claims

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Application Information

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IPC IPC(8): H01L21/8239
CPCH10B99/00
Inventor 黄河李海艇克里夫·德劳利
Owner SEMICON MFG INT (SHANGHAI) CORP