Unlock instant, AI-driven research and patent intelligence for your innovation.

Polyimide film with low dielectric constant, and manufacturing method therefor

A polyimide film, polyimide technology, applied in chemical instruments and methods, electronic equipment, other household appliances, etc., can solve problems such as high dielectric constant and high dissipation coefficient

Inactive Publication Date: 2015-08-12
TAIMIDE TECH
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that polyimide film has a high dielectric constant and a high dissipation factor, and it still has disadvantages and limitations as a high-frequency material.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide film with low dielectric constant, and manufacturing method therefor
  • Polyimide film with low dielectric constant, and manufacturing method therefor
  • Polyimide film with low dielectric constant, and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Preparation of the first polyimide slurry: put 15.661 kg of TFMB and 132.6 kg of DMAc into a 200L reactor. After stirring at 30°C until completely dissolved, 21.63 kg of 6FDA was added. The monomer accounted for 22wt% of the total weight of the reaction solution. Then, add 15.98 kilograms of PTFE powder (accounting for 30wt% of the total monomer weight), keep stirring, and continue to react at 25°C for 24 hours to obtain the slurry of the first polyimide, which can be obtained at 25°C The rotational viscosity is 200,000cps.

[0054] Preparation of the second polyimide slurry: repeat the preparation steps of the first polyimide layer in Example 1, but without adding PTFE.

[0055] Preparation of polyimide film: The above-mentioned polyimide slurry is configured in the form of "second slurry-first slurry-second slurry", and is coated in a three-layer co-extrusion method, in continuous The polyimide film was prepared in the formula preparation process. The total thickn...

Embodiment 2

[0057] The first polyimide slurry: the monomer composition was changed to 19.492 kg of TFMB and 17.819 kg of BPDA. The monomer accounted for 22wt% of the total weight of the reaction solution.

[0058] The slurry of the second polyimide: with embodiment 1.

[0059] All the other ingredients and steps are the same as in Example 1.

Embodiment 3

[0061] The first polyimide slurry: the monomer components were changed to 11.61 kg of ODA and 25.66 kg of 6FDA. The monomer accounted for 22wt% of the total weight of the reaction solution.

[0062] The slurry of the second polyimide: with embodiment 1.

[0063] All the other ingredients and steps are the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a polyimide film with a low dielectric constant, and a manufacturing method therefor. The film comprises a first sub-layer which comprises first polyimide and fluorine-containing high-molecular particles distributed therein. The first polyimide is prepared through the reaction of a first diamine and a first dianhydride, wherein the chemical formula of at least one of the first diamine and the first dianhydride comprises a fluorine atom. The film also comprises a second sub-layer which is formed by second polyimide, wherein the second is prepared through the reaction of a second diamine and a second dianhydride, and chemical formula of at least one of the second diamine and the second dianhydride comprises a fluorine atom. The first and second polyimides are similar or the same.

Description

technical field [0001] The invention relates to a polyimide film and a manufacturing method thereof, in particular to a polyimide film with low dielectric constant and high peel strength and a manufacturing method thereof. Background technique [0002] With the development of technology and product demand, the size of printed circuit boards tends to be light, thin, short, and small. With the high frequency of wireless networks and communication products, high-frequency substrates with fast transmission rates have gradually become the focus of development. As the material used in the high-frequency communication substrate, it is the basic requirement to be able to transmit data quickly, and the data cannot be lost or disturbed during the transmission process. [0003] It is known that the delay caused by the transmission of electronic signals between metal wires is the main reason for the speed limitation of semiconductor components. In order to reduce the time delay of sign...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/28B32B37/06C08G73/10
CPCB32B7/00B32B7/06B32B27/06B32B27/18B32B27/28B32B2250/40B32B2264/00B32B2264/0242B32B2307/20B32B2307/748B32B2457/00B32B2250/00C09D179/08B32B27/281B32B27/08B32B27/20B32B2307/204B32B2457/08C08L79/08B32B2250/24
Inventor 林志维赖俊廷
Owner TAIMIDE TECH