Method for improving graphene and copper basal body binding force in copper-based graphene composite material

A graphene composite and composite material technology, which is applied in the field of improving the bonding force between graphene and copper matrix in copper-based graphene composite materials, can solve the problems of weakening the performance of graphene, achieve good application prospects, excellent electrical conductivity, and enhance interface bonding force effect

Active Publication Date: 2015-08-26
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Abstract
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  • Application Information

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Problems solved by technology

However, this method will weaken the performance of graphene due to the change of the surface structure of graphene.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The present embodiment provides a kind of high-performance copper-chromium alloy graphene composite material, and the preparation method of this composite material is as follows:

[0029] (1) Copper powder and chromium powder are mechanically alloyed to obtain copper-chromium alloy powder, wherein the atomic percentage of chromium powder accounts for 1%;

[0030] (2) take graphene, the ratio of the quality of the graphene quality and the copper-chromium alloy powder in step (1) is 2:998, this graphene is added in the ultrasonic 2h in ethanol, obtains that concentration is 0.2g / L Graphene ethanol dispersion;

[0031] (3) the copper chromium alloy powder that step (1) obtains is joined in the ball mill jar, pours the graphene dispersion liquid prepared in step (2) again and carries out high-speed ball milling, is 2:1 by ball material ratio, and ball milling speed is 300r / min, ball milling time 10h, then the slurry is suction-filtered and vacuum-dried to obtain copper-ch...

Embodiment 2

[0047] The present embodiment provides a kind of high-performance copper-titanium alloy graphene composite material, and the preparation method of this composite material is as follows:

[0048] (1) Mechanically mixing copper powder and titanium powder to obtain copper-titanium alloy powder, wherein the atomic percentage of titanium powder accounts for 2%;

[0049] (2) Take graphene, the ratio of the graphene quality to the mass of the copper-titanium alloy powder in step (1) is 5:995, add the graphene to ethanol for ultrasonic 2h, and obtain a concentration of 0.3g / L Graphene ethanol dispersion;

[0050] (3) The copper-titanium alloy powder that step (1) obtains is added in the ball mill jar, pours the graphene dispersion liquid that step (2) prepares again and carries out high-speed ball milling, is 2:1 by ball material ratio, and ball milling speed is 400r / min, the ball milling time is 10h, then the slurry is suction-filtered and vacuum-dried to obtain copper-titanium all...

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Abstract

The invention provides a method for improving graphene and copper basal body binding force in a copper-based graphene composite material; and the method prepares the composite material by a spark plasma sintering technology through adding a small amount of alloy elements in a copper basal body and mixing the alloy elements with graphene. Experiments prove that the method improves the interface binding force of the basal body and a graphene reinforcement phase in the composite material; and compared with a composite material prepared by adding no alloy element, high tensile resistance is achieved. In addition, the copper-based graphene composite material with excellent heat conductivity, electricity conductivity and wear resistance can be obtained by optimizing the adding quantity of the alloy elements and the mass of the graphene, so that excellent application prospect is achieved.

Description

technical field [0001] The invention relates to the technical field of metal-based composite materials, in particular to a method for improving the bonding force between graphene and a copper matrix in a copper-based graphene composite material. Background technique [0002] Copper and copper alloy materials have the advantages of good electrical and thermal conductivity and easy molding, and have been widely used in aerospace, transportation, machinery industry, energy chemical industry, communication, electrical, power electronics, and national defense industries. With the development of modern science and technology, traditional copper and copper alloys can no longer meet the performance requirements of practical applications. By adding fillers with the lack of performance of the metal matrix to the copper and copper alloy matrix, it has a more excellent comprehensive performance. Performance, can effectively expand the application field of copper and copper alloy. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C9/00
Inventor 陈凡燕黄庆王义飞应家敏都时禹刘兆平
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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