Method for increasing copper tensile strength

A technology of tensile strength and deformation temperature, used in the field of non-ferrous metal plastic processing, can solve the problems of small copper material and equipment difficult to achieve such a high strain rate.

Inactive Publication Date: 2015-08-26
SOUTHWEST UNIVERSITY
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  • Abstract
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Problems solved by technology

For pure copper or copper alloys, the introduction of high-density twinned lamellar layers inside the crystal requires a high strain rate (strain rate greater than 5×10 3 the s -1 ), howe

Method used

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  • Method for increasing copper tensile strength
  • Method for increasing copper tensile strength
  • Method for increasing copper tensile strength

Examples

Experimental program
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Embodiment 1

[0031] First, a commercial extruded pure copper rod with a diameter of 10mm is processed into a dog bone shape (thick at both ends, thin in the middle parallel section, and the diameter of the parallel section is 4mm); then it is placed on a torsion testing machine for torsional plastic deformation, torsion Deformation At room temperature, with a torsional speed of 2rpm, the maximum shear strain rate of the edge is 1.5×10 -2 the s -1 , reversed 11 times.

[0032] figure 1 is the initial microstructure of extruded pure copper, where figure 1 a is the electron backscatter diffraction (EBSD) grain boundary (GBs) composition map of the initial copper rod, figure 1 b is the pole figure of the initial copper rod {111}, figure 1 It shows that the bar grains before torsion are equiaxed, and have relatively weak {111} fiber texture parallel to the bar axis (RA), and there are a large number of 60° twins in the bar grains before torsion (TBs).

[0033] figure 2 It is the microst...

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Abstract

The invention provides a method for increasing copper tensile strength. The method comprises the step of performing torsion and plastic deformation on copper. According to the method disclosed by the invention, the copper is performed with the torsion and plastic deformation, so that the copper tensile strength can be increased by forming high-density nanoscale laminated dislocation interface structures in a graded distribution manner inside the copper; in addition, the shear rate, the deformation temperature and the deformation amount of the torsion treatment can be limited, the spaces among the laminated dislocation interfaces can be further fined, and the copper tensile strength can be increased.

Description

technical field [0001] The invention relates to the technical field of plastic processing of nonferrous metals, in particular to a method for improving the tensile strength of copper. Background technique [0002] Pure copper is a widely used engineering material. Traditionally, pure copper undergoes repeated rolling or drawing processes to refine the grain size to increase the tensile strength of copper and its alloys. Studies have shown that the tensile yield strength limit of pure copper prepared by repeated rolling or drawing is between 400 and 430Mp, which is mainly because the grains of copper are refined to a certain size after repeated rolling or drawing. The particle size cannot be further refined, resulting in the saturation of the tensile strength. There are other ways to improve the tensile properties of pure copper, such as: using magnetron sputtering (DCMP) or pulse electrodeposition (PE) technology, introducing high-density nano-twinned crystal layers in hig...

Claims

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Application Information

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IPC IPC(8): C22F1/08
Inventor 郭宁宋波
Owner SOUTHWEST UNIVERSITY
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