10 results about "Shear strain rate" patented technology

The utility model relates to the technical field of road surface deceleration strips, and provides a road surface assembled deceleration strip which comprises assembling frames, two sliding rails are fixedly arranged on the outer surfaces of the tops of the assembling frames, the multiple assembling frames are connected through inserting connection of inserting connection blocks and inserting connection grooves at the two ends, and connecting plates are inserted into the splicing connection grooves in the bottoms of the assembling frames. A plurality of second bolts are screwed into second screw holes, a plurality of deceleration strip bodies are slidably inserted into the top of the assembling frame through sliding rails, a plurality of first bolts are screwed into first screw holes, the deceleration strip bodies are fastened to the top of the assembling frame, and a plurality of reinforcing bolts are inserted into second reinforcing holes and first reinforcing holes to be screwed; the non-Newtonian fluid material is injected into the through holes in the inner wall of the deceleration strip body and sealed through the sealing cover, the shear stress and the shear strain rate of the non-Newtonian fluid are not in a linear relation, a high-speed automobile is effectively decelerated, meanwhile, jolt generated when a low-speed automobile passes through the deceleration strip is reduced, and the service life of the deceleration strip is prolonged. And the effect and the use experience of the deceleration strip are improved.

The application discloses a kind of crustal strain rate field anomaly automatic extraction method and system, it is related to strain rate anomaly identification field, the method, comprising: obtaining the strain rate data of each position point in target area;Calculate principal strain rate standard deviation;The data of the principal strain rate standard deviation greater than the set multiple in principal strain rate data is extracted to obtain target data;From strain rate data, extract the surface strain rate of each principal strain rate anomaly point position;Determine the principal strain rate anomaly range circle based on the surface strain rate of principal strain rate anomaly point position;In target area, draw the surface strain rate contour line with 0 value as center, to determine surface strain rate anomaly range;Determine shear strain rate anomaly range based on the statistical histogram of shear strain rate;According to principal strain rate anomaly range circle, surface strain rate anomaly range and shear strain rate anomaly range, determine the crustal strain rate field anomaly area of target area.The application can improve the accuracy of crustal strain rate field anomaly area identification.

The present invention proposes a method for obtaining a staged damage shear constitutive model that accounts for the rate effect of composite materials. The method first conducts dynamic shear mechanical property tests of composite materials at multiple strain rates, recording the shear strain rate and shear stress-strain data for each test. A staged damage shear constitutive model with unknown parameters is proposed based on the characteristics of staged damage to the fiber and matrix within the composite material. A particle swarm optimization algorithm is used to obtain the parameter values ​​of the staged damage shear constitutive model corresponding to each test data point at the corresponding strain rate. A polynomial fitting method is used to obtain a functional relationship between the parameter values ​​of the staged damage shear constitutive model and the strain rate. The functional relationship between the parameter values ​​of the staged damage shear constitutive model and the strain rate is then substituted into the staged damage shear constitutive model with unknown parameters to obtain a staged damage shear constitutive model that accounts for the rate effect of the composite material. The present invention can characterize the shear constitutive relationship of composite materials under dynamic loads.

The invention relates to the technical field of amorphous alloy preparation and die-casting forming, and provides a die-casting amorphous alloy mechanical property regulation and control method which comprises the steps that S1, selected amorphous alloy raw materials are placed into a smelting crucible; s2, a smelting vacuum environment is constructed; s3, the smelting crucible is heated, so that the amorphous alloy raw materials in the smelting crucible are molten into a molten state; s4, the amorphous alloy melt is poured into a charging barrel; s5, the amorphous alloy melt in the charging barrel is injected into a cavity of the die-casting die; the shear strain rate during mold filling of the amorphous alloy melt is regulated and controlled by adjusting the injection rate; s6, the amorphous alloy melt is subjected to pressure maintaining solidification, and an amorphous alloy structural part is obtained after mold opening; and S7, the amorphous alloy structural part is machined into the standard test size to be subjected to mechanical property detection, and technological parameters meeting the target performance requirement are screened out. By means of the method, the problems that an existing amorphous alloy is single in performance regulation and control means and high in cost can be solved.

The application relates to the field of power module reliability evaluation, and particularly discloses a crystal plasticity constitutive model construction method based on a density characteristic, which comprises the following steps: S1: modifying the initial value and the saturation value of a critical decomposed shear stress through a correction coefficient; S2: taking the initial value and the saturation value of the corrected critical decomposed shear stress obtained in the step S1 as parameters and substituting the parameters into a hardening law of a crystal plasticity constitutive model to establish the crystal plasticity constitutive model based on the density characteristic; and S3: simulating in finite element software based on the crystal plasticity constitutive model established in the step S2, inputting values of different density characteristic parameters and macroscopic shear strain rates, and calculating and outputting the mechanical performance prediction result of the material. The application effectively quantifies the influence of manufacturing process uncertainty on the mechanical performance of a packaging interconnection material by introducing the density characteristic parameter, and improves the accuracy of simulation analysis.

The invention relates to the field of power module reliability evaluation, and particularly discloses a crystal plasticity constitutive model construction method based on density characteristics, and the method comprises the steps: S1, correcting an initial value and a saturation value of critical decomposition shear stress through a correction coefficient; s2, taking the initial value and the saturation value of the corrected critical decomposition shear stress obtained in the step S1 as parameters, substituting the parameters into a hardening law of a crystal plasticity constitutive model, and establishing the crystal plasticity constitutive model based on density characteristics; and S3, based on the crystal plasticity constitutive model established in the step S2, performing simulation in finite element software, and calculating and outputting a mechanical property prediction result of the material by inputting values of different density characteristic parameters and a macroscopic shear strain rate. According to the method, the influence of the manufacturing process uncertainty on the mechanical property of the packaging interconnection material is effectively quantified by introducing the density characteristic parameters, and the accuracy of simulation analysis is improved.

The invention discloses a crystal plasticity constitutive model construction method under an ultrasonic vibration auxiliary processing condition, and relates to the technical field of ultrasonic auxiliary processing, a multi-stage deformation frame is constructed, and a total deformation gradient is decomposed into an elastic deformation gradient, a plastic deformation gradient and a thermal deformation gradient; introducing an ultrasonic softening factor and a thermal softening factor into the classic crystal plastic constitutive model, and correcting a shear strain rate expression; establishing a crystal plasticity constitutive equation considering the ultrasonic vibration and temperature coupling effect; establishing a three-dimensional polycrystalline representative volume element model, and applying an ultrasonic cyclic load and a thermal load in finite element software; and developing a user material subprogram, and integrating the crystal plasticity constitutive equation to a finite element platform for numerical simulation. The method is closer to actual material response, the problem that the ultrasonic thermal coupling effect is difficult to accurately simulate by a crystal plasticity finite element method is solved, and the model prediction precision is improved.

The invention discloses a display module, a display device and a manufacturing method. The display module of one embodiment comprises: a substrate comprising a first surface and a second surface arranged opposite to the first surface; the display screen is located on the first surface and comprises a display area, a non-display area at least surrounding the display area and a binding area located on the boundary of one side of the non-display area; the binding part is bound with the binding area; the driving chip is located on the binding part, and the binding part is folded to the second surface after being bound; the display module further comprises a stress buffer layer located between the second surface and the portion, close to the second surface, of the binding part, and the shear strain rate of the stress buffer layer and the impact force acting on the stress buffer layer are in a nonlinear relation, so that the risk that the driving chip breaks is reduced, and the reliability of the display module is improved. Therefore, the reliability of the display module is protected.

The present disclosure provides: a three-dimensional molded body that contains a liquid crystal polymer, can be molded without any defects in appearance, and has a deep-drawn part; and a method for producing the three-dimensional molded body.　A three-dimensional molded body (1) according to the present disclosure comprises a liquid crystal polymer film containing a thermoplastic liquid crystal polymer, or a film-form or sheet-form laminate including the liquid crystal polymer film, and has a structural part (10) composed of a bottom-surface part (11) and a side-surface part (12) that rises from the peripheral edge of the bottom-surface part. The ratio (H / W) of the maximum height (H) [mm] of the structural part to the maximum outside diameter (W) [mm] of the side-surface part is 1 / 10 to 5 / 10. The thermoplastic liquid crystal polymer has a melt shear viscosity of 3,000 to 90,000 Pa∙s at a temperature of Tm+15°C which is obtained by adding 15°C to the melting point (Tm) of the thermoplastic liquid crystal polymer and a shear strain rate of 0.1 rad / s, and has a melt shear viscosity of 80 to 1,000 Pa∙s at the temperature of Tm+15°C and a shear strain rate of 100 rad / s.

This invention relates to a FOW (Field-Write Object) stacked packaging structure with bonding grooves. This FOW stacked packaging structure modifies the traditional form of the FOW film, obtaining a FOW film with bonding grooves through exposure and development. After the FOW film with bonding grooves is bonded to a second chip, the FOW film with bonding grooves is vertically bonded to a first chip and the bonding wires connecting the first chip to the substrate. The bonding wires connecting the first chip to the substrate are inserted into the bonding grooves of the FOW film. Heating melts and reshapes the bonding grooves, allowing the FOW film to complete the bonding and stacking process between the first and second chips, thus realizing this FOW stacked packaging structure with bonding grooves. In response to the trend of increasingly smaller bonding wire diameters, this design expands the applicability of FOW films, reducing requirements on their flowability, shear stress, and shear strain rate, thus improving their versatility. This FOW stacked packaging structure with bonding wire grooves ensures that the bonding wires connecting the first chip to the substrate are not subjected to the stress applied during chip bonding, significantly reducing defects such as loose connections and wire punching. Furthermore, this FOW stacked packaging structure with bonding wire grooves allows for the selection of more long-shelf-life FOW materials, reducing additional costs incurred due to film expiration and improving the utilization rate of FOW films.