Method of metalizing reverse side of single pipe core

Abstract

The invention discloses a method of metalizing the reverse side of a single pipe core. A glass ceramics substrate is divided into glass ceramics partition strips, and the glass ceramics partition strips are adhered to a film glass ceramics substrate as a substrate, so that a pipe core holding groove is formed between two adjacent glass ceramics partitions strips; the reverse side of the single pipe core is upwards placed in the pipe core holding groove of a pipe core holding die and the pipe core holding die is sent into a sputtering chamber of a magnetron sputtering platform; argon is introduced in the sputtering chamber to be used as a reactant gas; the pipe core is firstly subjected to reactive sputtering and then is subjected to magnetron sputtering; an adherency barrier layer is deposited on the reverse side of the pipe core by using a NiCr alloy target; a welding layer is deposited on the reverse side of the pipe core by using an Au target material with the purify of 99.99%; and after sputtering is completed, the die is taken out, and the pipe core subjected to sputtering treatment is placed in a chip box. The invention has the advantages that the technology is reasonable; the operation is simple; the reverse side metalizing treatment can be carried out on the single pipe core with a relatively small size; and the method is suitable for industrial production.

Description

technical field [0001] The invention relates to a method for metallizing the back of a tube core, in particular to a method for metallizing the back of a single small tube core. Background technique [0002] In recent years, with the rapid development of integrated circuit technology, the guarantee and improvement of integrated circuit reliability are facing great challenges. The requirements for the welding process of chips used in the manufacture of integrated circuits in integrated circuits are getting higher and higher. Due to the thermal properties of eutectic sintering , Electrical properties and mechanical properties are much better than conductive adhesive bonding, so it is required to use eutectic sintering instead of using traditional organic adhesives in the way of interconnection between chips and sockets, chips and substrates. However, the basic requirement of eutectic sintering is that there is a metallized layer on the back of the die. At present, most of the ...

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Problems solved by technology

However, the basic requirement of eutectic sintering is that there is a metallized layer on the back of the die. At present, most of the dies imported from abroad do not have a metallized layer on the back of the die, and they are all single small dies that cannot be clamped to the metal. On the fixture of the metallization equipment, this makes it difficult to implement the backside metallization of a single die

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