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Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film

A technology of transparent conductive film and conductive pattern, which is applied in the field of conductive pattern formation method, conductive film, conductive pattern and transparent conductive film, can solve the problems of low resistance ultra-fine pattern electrodes, and achieve the effect of improving transparency and insulating properties

Active Publication Date: 2017-08-15
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Although the above-mentioned prior art discloses a variety of methods for forming metal micro-pattern electrodes using various processes, there are still certain problems in the formation of low-resistance ultra-fine pattern electrodes.

Method used

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  • Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film
  • Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film
  • Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film

Examples

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preparation example Construction

[0061] Conventional methods of preparing metal nanoparticles include a physical method of physically grinding a metal block and a method of chemical preparation. The chemical method is specifically described, including: the aerosol method of spraying high-pressure gas to prepare powder; the pyrolysis method of preparing powder by thermal decomposition using metal compounds and gas reducing agents; heating and evaporating raw materials to prepare powder Evaporation condensation method; sol-gel method, hydrothermal synthesis method, ultrasonic synthesis method, microemulsion method and liquid phase reduction method, etc. The liquid-phase reduction method using dispersants and reducing agents is the most widely used method because it is easy to control the formation of nanoparticles and has the best economic effect. However, in the present invention, any method can be used as long as it can form nanoparticles.

[0062] A specific description of a method for preparing nanoparticl...

preparation example 1

[0129] [Preparation Example 1] (400CAM etchant)

[0130] After adding 18g of isobutyl carbamate, 70g of isobutylamine, and 2g of 95% 2-amino-2-methyl-1-propanol in a 200ml beaker, use a sonicator (Sonicator) to fully dissolve for 20 minutes, Then slowly add 10 g of 30% hydrogen peroxide, and stir for 10 minutes to prepare an etchant.

preparation example 2

[0131] [Preparation Example 2] (400-800CAM etchant)

[0132] In a 200ml beaker, add 10g of isobutyl carbamate and 2-ethylhexyl carbamate (the molar ratio of the two is 1:1), 78g of 2-ethylhexylamine, 2g of 95% 2-amino- After 2-methyl-1-propanol was fully dissolved for 20 minutes using a Sonicator, 10 g of 30% hydrogen peroxide was slowly added and stirred for 10 minutes to prepare an etchant.

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Abstract

The invention provides a method for forming a conductive pattern and a conductive pattern component. The method is characterized in that it includes the steps of: a) filling conductive ink in the groove of the substrate having grooves; and b) dissolving the residue remaining on the surface of the substrate with an etching solution when filling the conductive ink conductive ink, and guide the conductive ink to the groove, so that the conductive ink is filled in the groove. In this way, a method for forming a low-resistance ultra-fine conductive pattern that is difficult to achieve in the prior art is provided. The method is to form a conductive pattern by filling the groove of the substrate with conductive ink, and dissolve the residue remaining on the surface of the substrate with an etching solution. conductive ink, and push and fill the conductive ink into the groove of the substrate. Furthermore, the present invention can also improve the transparency and insulating properties of the substrate.

Description

technical field [0001] The present invention relates to a method for forming a conductive pattern, a conductive film, a conductive pattern and a transparent conductive film; in particular to a method for forming a conductive pattern, a conductive film, and a conductive pattern by filling conductive ink in a groove of a substrate to form a conductive pattern And a transparent conductive film, wherein in the formation method of the conductive pattern, the conductive ink remaining on the surface of the substrate is dissolved with an etching solution, and it is pressed and filled into the groove of the substrate to form the conductive pattern. Background technique [0002] Recently, with the trend of miniaturization of electronic products, electronic components such as displays or transistors are required to be made into high-density and high-integration forms. Therefore, those that can be used for electrodes or metallization lines, and can be formed The technology of fine metal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/28
CPCC09D11/52H01L21/288H01L21/76802H01L21/76817H01L21/76877H05K3/1258H05K2203/0108H05K2203/0139H05K2201/0108H01L21/28H01L21/02282H10K71/12
Inventor 郑光春柳志勋李仁淑成俊基韩大尚
Owner INKTEC CO LTD