A method for depositing an alloy layer on a ceramic surface

Abstract

The invention discloses a method for depositing an alloy layer on the surface of ceramic. The method comprises the following steps: polishing and flattening the surface of a ceramic workpiece to be deposited through abrasive paper; arranging an element source to be sputtered in a hollow cathode cover, erecting the element source to be sputtered in the cover, and placing the polished ceramic workpiece to be deposited on the opposite side of the element source to be sputtered, wherein the hollow cathode cover, the element source to be sputtered and the ceramic workpiece to be deposited form an equipotential glow discharge cathode; treating the equipotential glow discharge cathode in direct current pulse diffusion metalizing equipment; measuring the temperature of the element source to be sputtered by utilizing an infrared thermometer, controlling the temperature to be 750-800 DEG C, and forming the uniform and compact alloy layer of which the thickness is 19 microns on the surface of the ceramic workpiece to be deposited. According to the method, the welding binding force between the ceramic and alloy metal can be improved, the alloy layer can be firmly combined with a ceramic material and is not easy to abrade and disengage; meanwhile, the alloy layer also has good conductive properties, and the color of the metal is long-lasting.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a method for depositing an alloy layer on a ceramic surface. Background technique [0002] At present, ceramic materials have many excellent properties and are widely used in power machinery industry, aerospace, heat exchangers, large-scale integrated circuits and electronic components. However, due to the inevitable shortcomings of ceramics such as non-conductivity and weak bonding with metal welding, the further wide application of ceramics is limited. Therefore, it is necessary to modify the surface of ceramics with metal or form a metal coating, and then connect with metal to form composite parts. The main way to apply. [0003] In the prior art, the technology of plating metal on the ceramic surface is mainly electroplating and magnetron sputtering technology. Since the ceramic itself is not conductive, it is necessary to deposit a layer of conductive medium on th...

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Problems solved by technology

However, due to the inevitable shortcomings of ceramics such as non-conductivity and weak bonding with metal welding, the further wide application of ceramics is limited. Therefore, it is necessary to modify the surface of ceramics to metal or form a metal coating, and then connect with metal to form composite parts. The main way to apply

[0003] In the prior art, the technology of plating metal on the ceramic surface is mainly electroplating and magnetron sputtering technology. Since the ceramic itself is not conductive, it is necessary to deposit a layer of conductive medium on the surface of the ceramic, and then place it in the required metal solution. Electroplating, the process is complicated, and it is easy to introduce impurities, which will affect the bonding force between ceramics and metals; although magnetron sputtering can solve the above problems well, but due to the low temperature and low power of magnetron sputtering, The thickness of the deposited metal layer is relatively thin, so it cannot meet the thickness of the deposited metal layer required for welding ceramics and metals

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