A low-temperature self-welding method for carbon-coated copper nanowires
A technology of copper nanowires and carbon coating, which is applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low working temperature and solder utilization rate, and achieve high utilization rate of copper atoms, large flow rate adjustment range, and high working efficiency. The effect of low temperature
Active Publication Date: 2017-02-22
咸阳瞪羚谷新材料科技有限公司
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[0007] The present invention mainly aims at the shortcomings and deficiencies in the field of nano-welding technology at present, and proposes a low-temperature self-welding method of carbon-coated copper nanowires based on the diffusion phenomenon of copper atoms after heating. The method has the advantages of low working temperature and large flow rate. Adjustable, high solder utilization rate and large-scale multi-point simultaneous welding, etc., are expected to be widely used in flexible electronic systems, semiconductor integrated circuits, micro-nano electronic device packaging, transparent electrodes and other fields
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[0020]The present invention will be further introduced below in conjunction with the accompanying drawings and specific implementation methods.
[0021] attached figure 1 It is a transmission electron microscope photo of copper nanowires coated with amorphous carbon shells on the surface synthesized by hydrothermal method in the present invention: figure 1 (a) is a photo of the nanowire at a lower magnification, and the diffraction spot proves the five-time twinning structure of the copper nanowire, figure 1 (b) is a high-resolution electron micrograph of the nanowires. It can be seen that the surface of the copper nanowires is covered by an amorphous shell. The details of the synthesis process of the whole copper nanowires are as follows:
[0022] Add 21 mg of copper chloride and 49 mg of glucose into 10 mL of deionized water in sequence, then add 180 mg of surfactant octadecylamine, and mix thoroughly for 5 hours with magnetic stirring; then transfer the solution to a 25 m...
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Abstract
The invention discloses a low-temperature self-welding method for carbon-coated copper nanowires, which relates to the field of nano-welding; the technical scheme of the welding method is to synthesize copper coated with a carbon shell and having a five-time twin structure by using a hydrothermal method Nanowires, when the copper nanowires overlap each other to form point contacts, when heated to 40%-70% of the melting point of bulk copper, that is, 300°C to 725°C, the copper atoms diffuse and utilize the carbon shell to form a point contact. The formed channel accumulates at the contact point, so that self-welding is realized without using other solders, and the effect of interconnection between copper nanowires is achieved; the invention of this nano-welding technology has the advantages of low working temperature, wide-range adjustable flow rate, It has the advantages of large-scale multi-point simultaneous welding, no need for solder, and no pollution; tests have proved that solder joints have excellent mechanical and electrical properties, which is expected to be widely used in flexible electronic systems, semiconductor integrated circuits, micro-nano electronic packaging, transparent electrodes, etc. .
Description
technical field [0001] The invention relates to the technical field of nano-welding, in particular to a low-temperature self-welding method for carbon-coated copper nanowires. Background technique [0002] Nanomaterials have attracted widespread attention due to their unique optical, electrical, magnetic and other physical properties. Scientists and engineers have controllably prepared a variety of nanomaterials through various synthetic methods. However, if these nanomaterials are to be formed with a certain structure And functional devices, these materials must be assembled using certain welding techniques. However, because the traditional macroscopic welding method cannot operate on nanoscale materials, nano-welding technology has become a hot and difficult issue in the field of nano-scale research. [0003] At present, there are three main types of connection technologies at the nanometer scale, namely electron beam / ion beam assisted deposition (EBID / IBID), nano fusion ...
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IPC IPC(8): B23K31/02
CPCB23K31/02
Inventor 单智伟陈凯万景春沈昊王晓光
Owner 咸阳瞪羚谷新材料科技有限公司