Transparent conductive film and capacitive touch screen including it
A technology of capacitive touch screen and transparent conductive film, which is applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problem of obvious three-dimensional lines between transparent conductive film and capacitive touch screen, and achieve stress difference reduction The effect of small size, reduced production of finished products, and simple manufacturing process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0037] The surface of the transparent base material layer 30 is coated with a hardening solution of the type FZ001 selected from Japan Arakawa Chemical Co., Ltd., dried and cured to form the first hardened layer 10 . Then, in the same manner, the surface of the transparent substrate layer 30 far away from the first hardened layer 10 is coated with a hardening solution selected from the Japanese DIC company with a model number of PC13-1082 to form the second hardened layer 50 .
[0038] Utilize the magnetron sputtering process, on the surface of the second hardened layer 50 away from the above-mentioned transparent substrate layer 30, a film is coated to obtain an amorphous ITO layer, forming figure 1 The transparent conductive film shown.
[0039] The amorphous ITO layer 70 of the transparent conductive film was etched by an ink screen printing etching method, and then baked at a temperature of 150° C. for 60 minutes. The specific structural parameters of the transparent cond...
Embodiment 2
[0041] Adopt the method identical with embodiment 1 to prepare figure 1 For the transparent conductive film shown, the structural parameters of the prepared transparent conductive film are shown in Table 1. The hardening solution for coating the first hardening layer 10 is the hardening solution of FZ001 from Japan Arakawa Chemical Co., Ltd., and the second hardening layer 50 is coated. The hardening solution is a mixed hardening solution of KZ6661 and FZ001 from JSR Corporation of Japan. The specific structural parameters of the transparent conductive film are shown in Table 1.
Embodiment 3
[0043] Adopt the method identical with embodiment 1 to prepare figure 1 For the transparent conductive film shown, the structural parameters of the prepared transparent conductive film are shown in Table 1. The hardening solution for coating the first hardening layer 10 is the hardening solution of FZ001 from Japan Arakawa Chemical Co., Ltd., and the second hardening layer 50 is coated. The hardening liquid used is the hardening liquid of the model KZ6666 of JSR Company in Japan. The specific structural parameters of the transparent conductive film are shown in Table 1.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com