Contact element, power semiconductor module and method of fabricating same
A technology for power semiconductors and contact elements, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, and components of semiconductor/solid-state devices, etc. It can solve the problems of time-consuming and expensive, complicated mechanical assembly, and contact posts hindering the operation of bonding machines, etc. For easy pressure, easy application
Active Publication Date: 2015-10-07
VINCOTECH
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, not only the provision of spring contacts complicates the mechanical assembly, but also the step of soldering the contact elements to the circuit carrier further complicates the assembly process
In particular, soldering steps always require additional cleaning and washing steps, which are time-consuming and expensive
In addition, when the contact posts are assembled prior to wire bonding or ribbon bond connections, there is a problem with the contact posts obstructing the operation of the bonder
Method used
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Embodiment Construction
[0040] see figure 1 , shows a schematic view of a contact element according to the invention.
[0041] The contact element 100 according to the invention is connected to the circuit carrier 102 by means of a sintered connection 104 . To create this sintered connection 104 , the contact element 100 is formed as a two-part part: a sintered contact part, in particular a socket element 106 , and a separate contact stud 108 . According to the first embodiment of the invention, the socket element 106 is formed from a rigid, flat, annular metal part which can withstand temperature and pressure during the sintering step without problems. In order to form the complete contact element 100, the socket element 106 is first sintered to the circuit carrier 102, and the contact post 108 is subsequently connected to the socket element. according to figure 1 In the illustrated embodiment, the contact studs are fixed in the socket element 106 by means of an interference force fit connection ...
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The present invention relates to a contact element for a power semiconductor module having a circuit carrier and at least one power semiconductor element. In particular, the present invention relates to such a power semiconductor module having an improved contact element for contacting an external electronic component. The present invention further relates to a method for fabricating such a power semiconductor module. Said contact element (100) comprises a sintered contact part (106, 134) being sintered to the circuit carrier (102) thereby being electrically connected to a conductive lead, and at least one contact pin (108) for contacting the external electronic component, said contact pin (108) being connected to the sintered contact part (106, 134) by means of a force-fit and / or form-fit connection.
Description
technical field [0001] The invention relates to a contact element for a power semiconductor module having a circuit carrier and at least one power semiconductor element. In particular, the invention relates to a power semiconductor module with improved contact elements for contacting external electronic components. The invention also relates to a method for producing the power semiconductor module. Background technique [0002] Power semiconductors are already widely used in automotive electronics, energy management and industrial electric motors as well as automation technology. Usually, these power semiconductors are integrated together in a power semiconductor module, which is designed according to the specific application requirements. High power applications such as automotive, wind, solar and standard industrial drives require power modules that meet high reliability and thermal, mechanical and electrical durability demands. For example, these power modules may form...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/488H01L23/498H01L23/49H01L21/60
CPCH01L25/072H01L21/4853H01L23/49811H01L2924/0002H01R4/26H01R12/57H05K3/301H05K3/32H05K2201/10318H01L2924/00
Inventor M·格克齐A·M·维戈
Owner VINCOTECH