Method and apparatus of separating substrate from light emitting assembly

A technology for light-emitting components and substrates, which is applied to electrical components, semiconductor devices, laser welding equipment, etc., can solve the problems of low yield rate of laser stripping, and achieve the effect of improving yield rate

Inactive Publication Date: 2015-10-14
FOSHAN NATIONSTAR SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention provides a method and device for stripping the substrate of the light-emitting component to solve the problem of low laser stripping yield in the prior art

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  • Method and apparatus of separating substrate from light emitting assembly
  • Method and apparatus of separating substrate from light emitting assembly
  • Method and apparatus of separating substrate from light emitting assembly

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] An embodiment of the present invention provides a method for peeling off the substrate of the light-emitting component, the flow chart of the method is as follows figure 1 shown, including:

[0034] S101: providing a light-emitting component to be stripped;

[0035] refer to figure 2 , the light-emitting component to be stripped includes a first substrate 20, a gallium nitride epitaxial layer 21 on one side of the first substrate 20, and a metal subs...

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Abstract

The invention provides a method and apparatus of separating a substrate from a light emitting assembly. The method includes the steps: providing a to-be-separated light emitting assembly, wherein the light emitting assembly includes a first substrate, a gallium nitride epitaxial layer arranged at one side of the first substrate, and a metal substrate, and the gallium nitride epitaxial layer includes an N-type gallium nitride layer, an active layer and a P-type gallium nitride layer; and adjusting utilizing a laser generator to separate the first substrate through laser, wherein an aperture diaphragm is arranged on the path of laser emitted from the generator so that light spots of the laser are adjusted in size through the aperture diaphragm. In this way, light spots as small as possible can be utilized to carry out separation through laser, so less nitrides will be produced locally, and the substrate separation yield rate can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method and a device for peeling off a substrate of a light-emitting component. Background technique [0002] At present, gallium nitride-based LED light-emitting components have become one of the current research hotspots because of their advantages such as uniform current distribution, low heat generation, low voltage drop, and high luminous efficiency. [0003] An existing gallium nitride-based LED light-emitting component with a vertical structure includes a metal substrate, a metal reflective layer sequentially arranged on the metal substrate, a P-surface electrode, a P-type gallium nitride layer, an active layer, an N-type Gallium nitride layer and N surface electrode. The manufacturing process of this LED light-emitting device is to sequentially form a buffer layer, an N-type gallium nitride layer, an active layer, a P-type gallium nitride layer, a metal reflectiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00B23K26/36B23K26/073
CPCH01L33/005B23K26/073B23K26/36
Inventor 谭振贤
Owner FOSHAN NATIONSTAR SEMICON
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