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A method for making a PCB with multiple surface treatments

A surface treatment and production method technology, which is applied in the secondary treatment of printed circuits, printed circuit manufacturing, cleaning/polishing of conductive patterns, etc., can solve the problems of single processing methods, avoid mutual interference, prevent copper plating, The effect of increasing binding force

Active Publication Date: 2018-04-03
JIANGMEN SUNTAK CIRCUIT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims at the problem that the existing PCB surface treatment method is single, and provides a PCB manufacturing method including electric thick gold surface treatment, nickel-immersion gold surface treatment and anti-oxidation surface treatment

Method used

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  • A method for making a PCB with multiple surface treatments
  • A method for making a PCB with multiple surface treatments

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Embodiment

[0023] This embodiment provides a method for manufacturing a PCB with multiple surface treatments. The PCB is provided with an electric gold position, a nickel-immersion gold position, and an anti-oxidation position. The gold position is treated with immersion nickel gold surface treatment, and the anti-oxidation position is treated with anti-oxidation surface treatment.

[0024] The specifications of the PCB are as follows: completed board thickness: 1.6mm; completed minimum aperture: 0.25mm; diameter-to-thickness ratio: 8:1; bottom copper thickness: 0.5OZ; partial thick gold PAD (electrical gold position) gold thickness > 0.76um; Local immersion gold PAD (immersion nickel gold position) gold thickness > 0.05um; anti-oxidation film thickness (anti-oxidation position): 0.2-0.3um; minimum line width / spacing: 0.12 / 0.12mm.

[0025] The manufacturing method of the PCB comprises the following steps:

[0026] (1) Making multi-layer boards

[0027] According to the prior art, the c...

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Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method of a PCB integrating multiple surface treatments. By adjusting the production process of the PCB, the present invention advances the electric thick gold surface treatment, which is conventionally performed after the solder resist layer is produced, before the outer layer circuit is produced, and adjusts the corresponding process parameters, thereby effectively avoiding the mutual interaction of the three surface treatments. The problem of interference, so that there are three surface treatments on the same PCB. And by adjusting the process sequence and process parameters, when the anti-oxidation surface treatment is performed, the gold layer on the electrodeposition and the immersion nickel gold position will not be oxidized and will not form an organic film, which ensures the effect of various surface treatments. The use of volcanic ash grinding board when making the outer layer can increase the bonding force between the dry film used in the positive film process and the board surface, and prevent the electric gold bits from being plated with copper during pattern electroplating.

Description

technical field [0001] The invention relates to the technical field of PCB production and manufacturing, in particular to a method for manufacturing a PCB with various surface treatments. Background technique [0002] Surface treatment is the last process in the manufacturing process of PCB (Printed Circuit Board, printed circuit board). Surface treatment is to coat a layer of protective material on the copper surface of PCB to protect the copper surface of PCB and facilitate the welding of circuit board pads. properties and corrosion resistance. Common surface treatment methods include Immersion Gold, Immersion Silver, Immersion Tin, Electroplated Nickel Gold (Flash Gold), Leaded HASL, Lead-free HASL -LF), antioxidant (OSP) and light copper (Naked Copper). [0003] With the rapid development of electronic technology and the harsh use environment, a single surface treatment on PCB cannot meet customer requirements, and it is becoming more and more urgent to develop a combi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22H05K3/26H05K3/28
CPCH05K3/22H05K3/241H05K3/28
Inventor 陈勇武李渊张义兵华荣双
Owner JIANGMEN SUNTAK CIRCUIT TECH
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