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Pad plate for drilling and preparation method and application thereof

A technology of backing plate and resin layer, which is applied in the field of backing plate for drilling and its preparation, can solve problems such as easy breakage of drill needles, many burrs on the backing plate, plugged holes in the backing plate, etc., so as to reduce the rate of broken needles and solve the problems of plugged holes problem, the effect of reducing bottom burrs

Inactive Publication Date: 2015-11-11
烟台柳鑫新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for drilling and its preparation method and application, aiming at solving the problem that the existing backing plate has plug holes, drill needles are easy to break, and there are many burrs at the bottom of the backing plate. The problem

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  • Pad plate for drilling and preparation method and application thereof
  • Pad plate for drilling and preparation method and application thereof

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Experimental program
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Effect test

Embodiment 1

[0035] First, the first inner resin layer is attached to the upper surface of the structural material layer, and the second inner resin layer is attached to the lower surface of the structural material layer; then the first protective film material layer is attached to the first inner resin layer On the surface, the second protective film material layer is attached to the lower surface of the second inner resin layer; finally the first surface resin layer is attached to the upper surface of the first protective film material layer, and the second surface resin layer is attached to the second protection The bottom surface of the film material layer is used to obtain a backing plate for drilling.

[0036] Among them, in parts by weight, in the first inner resin layer and the second inner resin layer: take 25 parts of water, 45 parts of water-based polymer, 25 parts of water-based binder resin, and 5 parts of lubricating resin. The water-based polymer is composed of 60 parts of poly...

Embodiment 2

[0038] First, the first inner resin layer is attached to the upper surface of the structural material layer, and the second inner resin layer is attached to the lower surface of the structural material layer; then the first protective film material layer is attached to the first inner resin layer On the surface, the second protective film material layer is attached to the lower surface of the second inner resin layer; finally the first surface resin layer is attached to the upper surface of the first protective film material layer, and the second surface resin layer is attached to the second protection The bottom surface of the film material layer is used to obtain a backing plate for drilling.

[0039] Among them, in parts by weight, in the first inner resin layer and the second inner resin layer: take 25 parts of water, 45 parts of water-based polymer, 15 parts of water-based binder resin, and 15 parts of lubricating resin. The water-based polymer is 70 polyethylene glycol, 5 g...

Embodiment 3

[0041] First, the first inner resin layer is attached to the upper surface of the structural material layer, and the second inner resin layer is attached to the lower surface of the structural material layer; then the first protective film material layer is attached to the first inner resin layer On the surface, the second protective film material layer is attached to the lower surface of the second inner resin layer; finally the first surface resin layer is attached to the upper surface of the first protective film material layer, and the second surface resin layer is attached to the second protection The bottom surface of the film material layer is used to obtain a backing plate for drilling.

[0042] Among them, in parts by weight, in the first inner resin layer and the second inner resin layer: take 10 parts of water, 55 parts of water-based polymer, 25 parts of water-based binder resin, and 20 parts of lubricating resin. The water-based polymer is composed of 5 parts of viny...

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Abstract

The invention discloses a pad plate for drilling and a preparation method and application thereof. The pad plate sequentially comprises a first surface resin layer, a first protective film material layer, a first inner resin layer, a structural material layer, a second inner resin layer, a second protective film material layer and a second surface resin layer from top to bottom. The structural material layer, the inner resin layers, the protective film material layers and the surface resin layers are combined to form a multiple-layer pad plate. When the multiple-layer pad plate is used for drilling, the hole blockage problem during drilling can be effectively solved, a drill bit is protected, the breakage rate of the bit is reduced, and burrs at the bottom of a PCB are decreased. In addition, the pad plate further facilitates improvement of hole wall quality and reduction of later-period cleaning difficulty of the PCB and electroplating failure risk.

Description

Technical field [0001] The invention relates to the field of printed circuit boards, in particular to a backing plate for drilling and a preparation method and application thereof. Background technique [0002] The existing conventional backing boards are ordinary wood fiber boards, melamine boards, or laminated paper substrates. The main functions of these backing boards are to protect the surface of the drilling rig, ensure the flatness of the substrate ground and prevent burrs. However, when these backing plates are used for drilling, there are still problems such as plugging holes, fragile drill pins, and more burrs at the bottom of the backing plate, and this type of backing plate is mainly used in a larger aperture range (the aperture is mainly 0.35-1.0mm) , Resulting in greater restrictions on applications. [0003] Therefore, the existing technology needs to be improved and developed. Summary of the invention [0004] In view of the above-mentioned shortcomings of the prio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B23/08B32B27/10B32B27/08B32B37/14B32B37/02
CPCB32B23/08B32B27/08B32B27/10B32B37/02B32B37/144
Inventor 秦先志唐甲林罗小阳贺瑜
Owner 烟台柳鑫新材料科技有限公司