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A kind of capacitive pressure sensor and preparation method thereof

A pressure sensor, capacitive technology, applied in the direction of fluid pressure measurement, instrument, measurement force, etc. using capacitance change, can solve the problems of capacitive pressure sensor limitation, small output capacitance change, complex processing circuit, etc., to avoid MEMS Bonding process, simplified manufacturing process, the effect of simple process

Active Publication Date: 2017-11-03
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small change in output capacitance of traditional capacitive pressure sensors, it is not conducive to pressure detection. It is necessary to amplify the change in output capacitance through subsequent processing circuits, which makes the processing circuits often more complicated, so the application of capacitive pressure sensors is limited.

Method used

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  • A kind of capacitive pressure sensor and preparation method thereof
  • A kind of capacitive pressure sensor and preparation method thereof
  • A kind of capacitive pressure sensor and preparation method thereof

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Embodiment Construction

[0031] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] Such as figure 1 As shown, the embodiment of the present invention provides a capacitive pressure sensor, which includes SOI (corresponding to Chinese: silicon on an insulating substrate; English full name: Silicon-On-Insulator) silicon chip 1 arranged sequentially from bottom to top , single crystal silicon layer 3 , silicon dioxide layer 4 and polycrystalline silicon layer 5 . The SOI silicon wafer 1 is provided with a vacuum sealed chamber 2 . The silicon dioxide layer 4 comprises a first supporting layer 401, a second supporting layer 402 and a third supporting layer 403 arranged in parallel at equal heights, the first supporting layer 401 is located in the area directly above the vacuum sealed chamber 2, and the second supporting layer 402 and the third support layer 403 are located outside the area directly above the vacuum se...

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Abstract

The invention discloses a capacitive pressure sensor, including a SOI (Silicon-On-Insulator) silicon chip, a single crystalline silicon layer, a silicon dioxide layer and polysilicon layers. The SOI silicon chip is internally provided with a vacuum seal cavity. The silicon dioxide layer comprises with a first supporting layer, a second supporting layer and a third supporting layer which are identical in height and arranged in parallel. The first supporting layer is located in an upper area in the vacuum seal cavity. The second supporting layer and the third supporting layer are located outside of the upper area in the vacuum seal cavity. The second supporting layer is positioned between the first supporting layer and the third supporting layer. The polysilicon layers comprise a first polysilicon layer and a second polysilicon layer. The first polysilicon layer is fixedly connected on the first supporting layer and the second supporting layer. The second polysilicon layer is fixedly connected on the third supporting layer. One end surface of the first polysilicon layer is opposite to one end surface of the second polysilicon layer. The sensor has high efficiency and sensitivity in performance analysis. Meanwhile, the invention provides a preparation method of the sensor, and the preparation method is simple and easy to implement.

Description

technical field [0001] The invention relates to a pressure sensor, in particular to a capacitive pressure sensor and a preparation method thereof. Background technique [0002] Among the products realized by silicon micromachining technology, the pressure sensor is a relatively mature category. At present, pressure sensors have been widely used in various industrial and biomedical fields. Capacitive pressure sensors have gradually become a hot spot for pressure sensors due to their high sensitivity, better temperature performance, low power consumption, no temperature drift, firm structure, and little influence from external stress. Due to the small change in output capacitance of traditional capacitive pressure sensors, it is not conducive to pressure detection. It needs to amplify the change in output capacitance through subsequent processing circuits, which makes the processing circuits often more complicated. Therefore, the application of capacitive pressure sensors is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14G01L9/12
Inventor 聂萌包宏权黄庆安
Owner SOUTHEAST UNIV
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