Low-viscosity organosilicon sealant for LED (light-emitting diode) potting and preparation method thereof

A low-viscosity, silicone technology, applied in chemical instruments and methods, adhesives, other chemical processes, etc., to achieve excellent electrical properties, good sealing, and strong gap-filling ability

Inactive Publication Date: 2015-11-18
BLUESTAR CHENGDU NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem of silicone materials used in LED packaging in the prior art, and provides a low-viscosity silicone sealant for LED potting. The sealant machine has good performance and is very suitable for LED potting

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A low-viscosity silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0027] 107 silicone rubber 180 parts

[0028] Kaolin 20 parts

[0029] 40 parts of light calcium carbonate

[0030] 18 parts of lithopone

[0031] 15 parts of 201 silicone oil

[0032] Cross-linking agent XR-5005 parts

[0033] Coupling agent KH-5700.5 parts

[0034] Catalyst 0.5 parts.

Embodiment 2

[0036] A low-viscosity silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0037] 107 silicone rubber 200 parts

[0038] Kaolin 26 parts

[0039] 42 parts of light calcium carbonate

[0040] 21 parts of lithopone

[0041] 18 parts of 201 silicone oil

[0042] Cross-linking agent XR-5008 parts

[0043] Coupling agent KH-5705 parts

[0044] Catalyst 2 parts.

Embodiment 3

[0046] A low-viscosity silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0047] 107 silicone rubber 190 parts

[0048] Kaolin 23 parts

[0049] 41 parts of light calcium carbonate

[0050] Lithopone 19.5 parts

[0051] 16.5 parts of 201 silicone oil

[0052] Cross-linking agent XR-5006.5 parts

[0053] Coupling agent KH-570 2.75 parts

[0054] Catalyst 1.25 parts.

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PUM

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Abstract

The invention relates to a low-viscosity organosilicon sealant for LED (light-emitting diode) potting and a preparation method thereof, belonging to the technical field of organosilicon sealants. The organosilicon sealant is prepared from the following raw materials in parts by weight: 180-200 parts of 107 silicon rubber, 20-26 parts of kaolin, 40-42 parts of light calcium carbonate, 18-21 parts of lithopone, 15-18 parts of 201 silicone oil, 5-8 parts of crosslinking agent XR-500, 0.5-5 parts of coupling agent KH-570 and 0.5-2 parts of catalyst. The sealant main body silicon rubber main chain contains a silicon-oxygen structure, and has excellent insulation property, excellent ageing resistance, excellent sealing property and the like. The RTV (room-temperature vulcanizing) sealant has the characteristics of no toxicity, environment friendliness, high/low temperature resistance, weather resistance, radiation resistance, high void filling capacity, medium/pressure resistance, favorable sealability and the like, has excellent electric properties, and has favorable applicability in the aspect of LED potting.

Description

technical field [0001] The invention relates to a silicone sealant and a preparation method thereof. More specifically, the invention relates to a low-viscosity silicone sealant for LED potting and a preparation method thereof, belonging to the technical field of silicone sealants. Background technique [0002] At present, the sealing of car horns and car lamp coils, the packaging of photoelectric display operation blocks, operation panels and digital tubes of household appliances such as air conditioners, refrigerators, washing machines, microwave ovens, DVDs, audios, etc., and the packaging of photoelectric devices such as pixel tubes, etc. Silicone sealants are all imported products, such as Dow Corning, Toshiba, Shin-Etsu silicone products and so on. Due to the high price of imported products, long delivery time, it is difficult to obtain technical support when the process requirements are not met. [0003] The State Intellectual Property Office disclosed an invention w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J11/04C09K3/10
Inventor 毛云忠曹先军王凤德赵奕崔晓静高川刘咏梅
Owner BLUESTAR CHENGDU NEW MATERIALS
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