Solder-resistant conductive film on the surface of sensitive structure of space electrostatic accelerometer and its manufacturing process

Abstract

The invention discloses a solder-resistant conductive film on the surface of a sensitive structure of a space electrostatic accelerometer, which is composed of a titanium film layer, a platinum film layer and a gold film layer, and one side of the titanium film layer is bonded to the surface of the sensitive structural part of the space electrostatic accelerometer , and the other side is sequentially connected with the platinum film layer and the gold film layer. The solder-resistant conductive film of the present invention is all made of non-magnetic materials, so it will not generate noise interference to the measurement of the space electrostatic accelerometer, and all materials have a small linear expansion coefficient, which can ensure the contact between the base glass material and each film layer. Better matching ensures the stability of the film.

Description

technical field [0001] The invention relates to the technical field of precision equipment for space science loads, in particular to a solder-resistant conductive film used on the surface of a sensitive structure of a space electrostatic accelerometer, and a manufacturing process thereof. Background technique [0002] Electrostatic accelerometer is a kind of capacitive differential inertial acceleration sensor, which has the characteristics of low measurement frequency, high resolution and large dynamic range. It is especially suitable for measuring quasi-steady state and small acceleration signals. It plays an important role in the fields of control, active vibration reduction, satellite gravity measurement and so on. [0003] The system composition and measurement principle of the electrostatic accelerometer are as follows: figure 1 As shown, the main components include an inertial sensor probe and a detection and control drive circuit. The inertial sensor probe is mainly...

AI Technical Summary

Problems solved by technology

Although this method can avoid the soldering resistance requirements of the film, since the sensor needs to lead out as many as twenty electrode leads, and they are not on the same surface of the same structure, high temperature curing is required after gluing. The lead wire fixing method adds multiple processes, which makes the assembly of the sensor very difficult and reduces the reliability of the sensor

At the same time, in the test stage, the sensor inevitably needs to be disassembled and assembled many times, and the electrode leads are easy to break. Faced with the problem that the electrode leads need to be fixed many times, the original glue needs to be removed before each re-gluing. It is more difficult, and there is a risk of damaging the electrode pads, so the process of using conductive silver glue to fix the electrode leads of the electrostatic accelerometer sensor has many shortcomings

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