Semiconductor device tin dipping device
A technology for semiconductors and devices, applied in the field of tin dipping devices for semiconductor devices, can solve the problems of low work efficiency, high production cost, and increase the labor amount of workers, and achieve the effect of reducing labor amount, reducing production cost, and shortening process.
Active Publication Date: 2017-03-15
江阴亨德拉科技有限公司
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[0013] The present invention will be further described below in conjunction with specific drawings.
[0014] Such as Figure 1 ~ Figure 3 As shown: the semiconductor device dipping tin device includes the first pulling cylinder 1, the first pulling cylinder 2, the first tinning seat 3, the soldering cylinder 4, the soldering cylinder 5, and the fourth pulling cylinder 6. The first slider track 7, the blocking cylinder 8, the welding flux 9, the first pulling part 10, the third pulling cylinder 11, the third pulling cylinder seat 12, the slider 13, the second slider track 14. Bottom plate 15, second pulling member 16, pulling track 17, soldering track 18, first stopper cylinder seat 19, second upper tin seat 20, upper tin track 21, stopper 22, second stopper Cylinder base 23, the third pulling material 24, fixed seat 25, the second pulling material cylinder base 26, the fourth pulling material 27, the second pulling material cylinder 28, etc.
[0015] Such as Figure 1 ~ Fig...
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The invention relates to a semi-conductor apparatus tin dipping device. The semi-conductor apparatus tin dipping device comprises a baseplate and is characterized in that a tin feeding device, a material pulling device and a material blocking device; the tin feeding device comprises a fixed seat and a weld-aid part which are fixed to the baseplate; a weld-aid rail is mounted on the weld-aid part; a first tin feeding seat is mounted on the fixed seat; a weld-aid cylinder seat is arranged on the first tin feeding seat; a weld-aid cylinder is arranged on the weld-aid cylinder seat; a first slide block rail and a tin feeding rail are arranged on the first tin feeding seat; a slide block is arranged on the slide block rail and connected with a second tin feeding seat. When a material is in the weld-aid rail, the material pulling device pulls the material to the tin feeding rail through the cylinder, and the material is limited on the tin feeding rail through the material blocking device, and tin feeding of the material is completed through the tin feeding device. Through adoption of the tin dipping device, a procedure of manual tin feeding is eliminated, and automatic tin feeding is achieved, so that the work efficiency is improved, and the production cost is reduced.
Description
technical field [0001] The invention relates to a semiconductor device tin dipping device, which belongs to the technical field of semiconductor device tin dipping devices. Background technique [0002] Commonly used semiconductors need to be manually dipped in tin on the pins before being soldered to the circuit board, which increases the workload of workers, resulting in low work efficiency and high production costs. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a semiconductor device tin dipping device, which can meet the tin dipping requirements of semiconductor pins without manual operation. [0004] According to the technical solution provided by the present invention, the semiconductor device dipping tin device includes a bottom plate, which is characterized in that: a tinning device, a material pulling device and a material blocking device are installed on the bottom plate; Ins...
Claims
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IPC IPC(8): B23K3/06B23K101/40
CPCB23K3/06B23K2101/40
Inventor 陈伟徐勇叶建国韩宙程华胜魏春阳
Owner 江阴亨德拉科技有限公司