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A multi-scale joint method for improving the strength of brazing joints of conductive ceramic base materials

A technology of conductive ceramics and brazing joints, applied in welding equipment, workpiece edge parts, manufacturing tools, etc., can solve problems such as differences in thermal expansion coefficients, low joint strength, and large residual stress, and achieve increased strength, reduced residual stress, and improved The effect of strength reliability

Active Publication Date: 2017-04-12
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the problems of low joint strength, large residual stress and low reliability caused by the difference in thermal expansion coefficient between the ceramic base material and the metal in the existing conductive ceramic base material brazing method, and provides a multi-scale joint improvement of electrical conductivity. Method for the Strength of Brazed Joints of Ceramic-Based Materials

Method used

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  • A multi-scale joint method for improving the strength of brazing joints of conductive ceramic base materials
  • A multi-scale joint method for improving the strength of brazing joints of conductive ceramic base materials
  • A multi-scale joint method for improving the strength of brazing joints of conductive ceramic base materials

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specific Embodiment approach 1

[0033] Specific implementation mode 1: In this implementation mode, a multi-scale joint method for improving the strength of a conductive ceramic-based material brazed joint is carried out according to the following steps:

[0034] 1. Surface treatment of the connection surface of the conductive ceramic base material:

[0035] a. Use precision wire cutting technology to process the connecting surface of the conductive ceramic base material and the corresponding connector into a circular arc surface. If the thermal expansion coefficient of the conductive ceramic base material is smaller than the thermal expansion coefficient of the corresponding connector, the conductive ceramic base material The surface is convex, and the surface of the corresponding connector is concave, and the radians are equal; if the thermal expansion coefficient of the conductive ceramic base material is greater than the thermal expansion coefficient of the corresponding connector, the surface of the cond...

specific Embodiment approach 2

[0050] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the corresponding connector is metal or conductive ceramic base material. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0051] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the conductive ceramic-based base material refers to a ceramic-based material with conductive properties to be connected to itself or a metal-based material. Others are the same as in the first or second embodiment. In this embodiment, the conductive ceramic-based base material is boride-based ceramics, carbide-based ceramics, conductive oxide-based ceramics or conductive nitride-based ceramics.

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Abstract

The invention belongs to the field of soldering and relates to a multi-scale combined method for improving the strength of a soldered joint made of conductive ceramic base materials. The method solves the problems that a joint connected through an existing conducive ceramic base material soldering method is low in strength, and the residual stress is large and the reliability is low due to the thermal expansion coefficient difference between the ceramic base materials and metal. The method comprises the steps of 1, surface treatment of a conductive ceramic base metal connecting face, 2, solder preparation, 3, solder placement and 4, vacuum soldering connection. Due to the macro-scale and micro-scale combined effect, the joint stress is relieved to the maximum extent, and the strength reliability of the joint is improved. The compression-shear resistant strength of the obtained soldered joint made of the conducive ceramic base materials is 155-265 MPa, and the strength of the soldered joint is improved by 165-345% compared with a soldered joint adopting a conventional straight interface and no wild phase.

Description

technical field [0001] The invention relates to a multi-scale combined method for improving the strength of a brazing joint of a conductive ceramic base material. Background technique [0002] With its excellent high-temperature comprehensive performance, ceramic materials have broad application prospects in many extremely harsh environments such as aviation and aerospace, and are the preferred materials for hot-end components today. However, ceramic materials are brittle, and it is difficult to obtain large-sized and complex-shaped structural parts, which greatly limits the engineering application of ceramic materials. Therefore, realizing reliable connections between ceramic materials themselves or metal materials has become one of the key technologies for the application of ceramic materials. . Generally, the active brazing method is used to realize the connection of ceramic-ceramic and ceramic-metal. This method has simple process, good repeatability, and strong adaptab...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/008B23K1/19B23K1/20B23K33/00
CPCB23K1/008B23K1/19B23K1/20B23K33/00
Inventor 林铁松何鹏冯青华
Owner HARBIN INST OF TECH